SBIR Phase I: Innovative And Cost-Effective Process for Net-Shape Microfabrication of Ceramic Components

SBIR 第一阶段：陶瓷元件净形微加工的创新且具有成本效益的工艺

• 批准号: 0128326
• 负责人: Balakrishnan Nair
• 金额: $ 9.99万
• 依托单位: CERAMATEC, INC.
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2002
• 资助国家: 美国
• 起止时间: 2002-01-01 至 2002-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0128326&HistoricalAwards=false
• 关键词: SBIR; Phase; Innovative; Cost; Effective

This Small Business Innovation Research Phase I project will develop and characterize a novel ceramic material and microcomponent fabrication technique for two different industrial sectors: the fiber-optic communications industry and the chemical industry. Current processes for microcomponent fabrication, primarily based on silicon processing technology are expensive, and often do not meet the production rates required for optical component (fiber-connectors, beam splitters) fabrication or possess the desired high-temperature performance for chemical industry applications (micro-channel devices for gas separation/reforming). The objective of this project is to develop a cost-effective technique for microfabrication of components with properties and/or production efficiency comparable to or superior than silicon technology. The process will use a low-temperature, net-shape fabrication technique that is expected to be efficient, cost-effective, scalable and environmentally friendly (no-byproducts). The commercial benefits will be an alternative to silicon processing technology. The high production capacity and tight dimensional tolerances for components fabricated using this material/technique makes it an attractive option for optic fiber component manufacturers. The high achievable surface areas and the inherent thermochemical stability of ceramics make this material very attractive for fabrication of microchannel devices for gas separation/reformation.

该小型企业创新研究第一阶段项目将为两个不同的工业部门（光纤通信行业和化学工业）开发并表征新型陶瓷材料和微元件制造技术。目前主要基于硅加工技术的微元件制造工艺价格昂贵，并且通常无法满足光学元件（光纤连接器、分束器）制造所需的生产率，也无法满足化学工业应用（用于气体分离/重整的微通道装置）所需的高温性能。该项目的目标是开发一种经济高效的微加工组件技术，其性能和/或生产效率可与硅技术相当或优于硅技术。该工艺将采用低温、净形状制造技术，预计该技术将高效、经济、可扩展且环保（无副产品）。商业利益将成为硅加工技术的替代方案。使用这种材料/技术制造的组件的高生产能力和严格的尺寸公差使其成为光纤组件制造商的有吸引力的选择。陶瓷的高可实现表面积和固有的热化学稳定性使得这种材料对于制造用于气体分离/重整的微通道装置非常有吸引力。