SBIR Phase I: Smart Engineered Composites for Thermal Management

这个小企业创新研究（SBIR）一期项目将合成和巩固一种智能复合材料，铜-钨酸锆，具有高导热性（240 W/m）。K)和低热膨胀（5 × 10-6/K）用于热管理应用。随着封装密度和功率要求的增加，每特定面积产生越来越多的功率，从而产生更多的热量。考虑到元件尺寸的减小，目前的芯片性能限制与封装材料有关。钨酸锆（ZrW2O8）的负热膨胀最近的发现吸引了许多有趣的应用，特别是在热膨胀是一个主要问题的复合材料。铜（Cu）具有良好的导热性，但由于其与硅（Si）或砷化镓（GaAs）的热膨胀不匹配，目前尚未被用作热管理材料。Cu- ZrW2O8等复合材料由高导电性金属基体和具有强负热膨胀系数（CTE）的陶瓷相组成，是电子热管理应用的理想选择。本课题将采用微波等离子体法和低温化学镀膜法合成Cu-ZrW2O8复合材料。Cu-ZrW2O8复合材料的固结将采用等离子体压力固结（P2C）快速固结技术进行。在商业上，这种材料的主要应用是用于微电子器件的衬底和电子器件的散热器。它还将提高陶瓷在电绝缘体和功率晶体管模块中的性能。钨酸锆的其他潜在用途是牙齿填充物的热膨胀补偿。

This Small Business Innovation Research (SBIR) Phase I Project will synthesize andconsolidate a smart composite material, copper-zirconium tungstate, with high thermal conductivity (240 W/m.K) and low thermal expansion ( 5 x 10-6/K) for thermal management applications. As packaging densities and power requirements increase, more and more power is being generated per specific area, thereby generating more heat. The current chip performance limitation is related to packaging materials when considering the component size reduction. The recent findings of negative thermal expansion in zirconium tungstate (ZrW2O8) have attracted many interesting applications for this material particularly in composites where thermal expansion is a major concern. Copper (Cu) has good thermal conductivity but it is not currently in use as a thermal management material, because of its high thermal expansion mismatch with either silicon (Si) or gallium arsenide (GaAs). A composite such as Cu- ZrW2O8, consisting of a high-conductivity metallic matrix and ceramic phase with strongly negative coefficient of thermal expansion (CTE) is ideally suitable for electronic thermal management applications. In the project synthesis of Cu-ZrW2O8 composite will be achieved using the microwave plasma and low temperature chemical coating methods. Consolidation of Cu-ZrW2O8 composite will be carried out using a rapid consolidation technique, plasma pressure consolidation (P2C).Commercially, the major applications of this material are in substrates for microelectronics, and heat sinks in electronic devices. It will also improve the performance of ceramics in electrical insulators and power transistor modules.The other potential uses of zirconium tungstate are in thermal expansion compensation in dental fillings.