SBIR Phase I: Smart Engineered Composites for Thermal Management

该小型企业创新研究（SBIR）第一阶段项目将合成和巩固一种智能复合材料，钨酸铜锆，具有高导热率（240 W/m.K）和低热膨胀（5 x 10-6/K）的热管理应用。随着封装密度和功率需求的增加，每个特定区域产生越来越多的功率，从而产生更多的热量。当考虑到元件尺寸减小时，当前芯片性能限制与封装材料有关。最近发现的负热膨胀钨酸锆（ZrW 2 O 8）吸引了许多有趣的应用，特别是在复合材料中的热膨胀是一个主要的关注。铜（Cu）具有良好的导热性，但由于其与硅（Si）或砷化镓（GaAs）的高热膨胀失配，因此目前未用作热管理材料。由高导电性金属基体和具有强负热膨胀系数（CTE）的陶瓷相组成的复合材料（例如Cu-ZrW 2 O 8）理想地适用于电子热管理应用。本课题采用微波等离子体法和低温化学包覆法合成Cu-ZrW_2 O_8复合材料。Cu-ZrW_2 O_8复合材料的快速固结技术--等离子体压力固结（P_2C）是实现Cu-ZrW_2 O_8复合材料快速固结的一种新方法。钨酸锆还可以改善陶瓷在电绝缘体和功率晶体管模块中的性能。钨酸锆的其他潜在用途是在牙科填充物中的热膨胀补偿。

This Small Business Innovation Research (SBIR) Phase I Project will synthesize andconsolidate a smart composite material, copper-zirconium tungstate, with high thermal conductivity (240 W/m.K) and low thermal expansion ( 5 x 10-6/K) for thermal management applications. As packaging densities and power requirements increase, more and more power is being generated per specific area, thereby generating more heat. The current chip performance limitation is related to packaging materials when considering the component size reduction. The recent findings of negative thermal expansion in zirconium tungstate (ZrW2O8) have attracted many interesting applications for this material particularly in composites where thermal expansion is a major concern. Copper (Cu) has good thermal conductivity but it is not currently in use as a thermal management material, because of its high thermal expansion mismatch with either silicon (Si) or gallium arsenide (GaAs). A composite such as Cu- ZrW2O8, consisting of a high-conductivity metallic matrix and ceramic phase with strongly negative coefficient of thermal expansion (CTE) is ideally suitable for electronic thermal management applications. In the project synthesis of Cu-ZrW2O8 composite will be achieved using the microwave plasma and low temperature chemical coating methods. Consolidation of Cu-ZrW2O8 composite will be carried out using a rapid consolidation technique, plasma pressure consolidation (P2C).Commercially, the major applications of this material are in substrates for microelectronics, and heat sinks in electronic devices. It will also improve the performance of ceramics in electrical insulators and power transistor modules.The other potential uses of zirconium tungstate are in thermal expansion compensation in dental fillings.