SBIR Phase I: Photolithographic Patterning of Reactive Nano-scale Multilayer Materials for Hermetic Wafer Scale Packaging

SBIR 第一阶段：用于密封晶圆级封装的反应性纳米级多层材料的光刻图案化

• 批准号: 0318954
• 负责人: Tanya Snyder
• 金额: $ 10万
• 依托单位: MicroHouse Technologies
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2003
• 资助国家: 美国
• 起止时间: 2003-07-01 至 2004-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0318954&HistoricalAwards=false
• 关键词: SBIR; Phase; Photolithographic; Patterning; Reactive

This Small Business Innovation Research Phase I project involves a feasibility study of lithographically patterning reactive nanoscale multilayer foils for use in hermetic waferscale packages for MEMS and other electronic devices. A patterned reactive foil sandwiched between two wafers can be ignited and will self-propagate, providing the heat needed for wafer bonding. Because the reaction is very rapid, heat is localized to the vicinity of the foil. Therefore high temperature hermetic bonds confined to the lithographic pattern are obtainable, while temperature sensitive components inside of the sealed package remain unaffected. These foils can also be used to join dissimilar materials with dramatically different thermal expansion coefficients without creating large residual stresses. A typical MEMS device produced today, 80% of the manufacturing cost goes into packaging. Waferscale packaging will dramatically reduce this cost because it leverages knowledge, equipment, and cost models from the semiconductor industry. Features include hermeticity, miniaturization, massively parallel assembly, automated equipment with increased repeatability and yields, and substantial integration of electronic, optical, and mechanical features. Patterning of reactive foils as covered in this proposal will enable wafer bonding that can be generically used for low cost miniaturized packaging of sensing, optical, medical, RF and other MEMS devices.

这个小型企业创新研究第一阶段项目涉及光刻图案化反应纳米级多层箔的可行性研究，用于MEMS和其他电子设备的密封晶圆级封装。夹在两个晶片之间的图案化反应箔可以被点燃并自我传播，提供晶片键合所需的热量。因为反应非常迅速，所以热局限于箔的附近。因此，可获得局限于光刻图案的高温气密结合，而密封封装内部的温度敏感部件保持不受影响。这些箔也可用于连接具有显著不同的热膨胀系数的不同材料，而不会产生大的残余应力。今天生产的典型MEMS器件，80%的制造成本用于封装。晶圆级封装将大大降低这一成本，因为它利用了半导体行业的知识、设备和成本模型。其特征包括密封性、小型化、大规模并行组装、具有增加的可重复性和产量的自动化设备以及电子、光学和机械特征的实质性集成。如本提案中所涵盖的反应性箔的图案化将使得能够实现晶片键合，其通常可用于感测、光学、医疗、RF和其他MEMS器件的低成本小型化封装。