SBIR Phase I: Wired Fiber: Direct Fiber Connection to Silicon Based on Anodic Bonding for Epoxy-less Fiber Pigtailing of Optoelectronic Components

SBIR 第一阶段：有线光纤：基于阳极键合的直接光纤连接至硅，用于光电元件的无环氧树脂光纤尾纤

• 批准号: 0319968
• 负责人: Don Abeysinghe
• 金额: $ 9.81万
• 依托单位: Taitech, Inc.
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2003
• 资助国家: 美国
• 起止时间: 2003-07-01 至 2003-12-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0319968&HistoricalAwards=false
• 关键词: SBIR; Phase; Wired; Fiber; Direct

This Small Business Innovation Research Phase I project addresses development of an epoxy-less fiber pigtailing technology using anodic fiber bonding appropriate for use with telecommunications transmitters or receivers, or for integration of sensors directly with fibers. The subgoals include: development of the anodic bonding technology for parallel fiber; modeling of the stress distribution in the fiber due to this bonding; characterization of the strength of the fiber-to-Si bond; and, fabrication of a prototype Si bench with a V-groove suitable for passive alignment of fiber to an active device and measurement of the thermal stability of the coupling efficiency. This is based on a solid body of preliminary work, including demonstration of facet-to-Si anodic bonding, and development of telecommunications modules using epoxied fiber-in-a-V-groove to telecommunication laser characterization The research will result in unprecedented levels of cost effectiveness, device performance, miniaturization, and ruggedness of a variety of photonic devices. This will substantially increase U.S. competitiveness in international microelectronics production, new fabrication and assembly technologies. Applications may be found in detection, telecommunications, information processing, micro-opto-electro-mechanical systems (MOEMS), and X-ray device technologies.

这个小型企业创新研究第一阶段项目致力于开发一种无环氧光纤拖尾技术，该技术使用阳极光纤粘合，适用于电信发射器或接收器，或用于传感器与光纤的直接集成。子目标包括：开发平行光纤的阳极键合技术；模拟这种键合在光纤中的应力分布；表征光纤与硅的键合强度；以及制造适用于光纤与有源器件的被动对准的具有V型槽的硅台原型，并测量耦合效率的热稳定性。这是建立在坚实的前期工作基础上的，包括演示面到硅阳极键合，以及使用环氧化光纤在V槽中进行电信激光表征的电信模块的开发。这项研究将导致各种光子设备达到前所未有的成本效益、器件性能、小型化和坚固性水平。这将大大提高美国在国际微电子生产、新制造和组装技术方面的竞争力。可在探测、电信、信息处理、微光机电系统(MOEMS)和X射线设备技术中找到应用。