High performance thermal profiling of photonic integrated circuits
High performance thermal profiling of photonic integrated circuits
批准号:
0321449
负责人:
Janice Hudgings
金额:
$0.0万
依托单位:
依托单位国家:
美国
项目类别:
Continuing Grant
财政年份:
2003
资助国家:
美国
项目状态:
已结题
起止时间:
2003-09-01 至 2007-08-31
中文摘要
正如越来越复杂的硅集成电路的巨大成功需要开发详细的片上测试和晶圆级探测策略一样,复杂光子集成电路(PICs)的未来进展将依赖于集成光电子器件的晶圆级光学轮廓的非侵入技术的发展。这个建议是发展热反射技术,这将使我们前所未有地进入复杂光子电路中的光传播。PI将开发一种热分析技术,将热反射成像与用于外部热交换的新型总能量平衡模型相结合,实现非接触式三维热成像,空间分辨率为100 nm,时间分辨率小于1 ms,温度分辨率为1-100 mK。这比商用红外显微镜好一个数量级,比液晶测温快得多。这种先进的技术将使PI实现以下技术进步:1)PICs的无创光学轮廓,2)开发一种从光电器件晶格表面温度提取载流子温度分布的新技术,3)三维热成像,以及4)测量工作的光电器件内部的热瞬态。该提案将通过在世界排名前20位的女子本科文理学院Mount Holyoke College和世界一流的技术大学MIT之间建立合作关系,显著加强研究和教育的基础设施。此外,该提案将研究与各级学习的教育相结合:在三年的研究计划期间,来自芒特霍利奥克的6-8名本科女学生将与麻省理工学院的一名研究生合作开展该项目。Mt Holyoke特别重视将前沿研究融入下一代女科学家和工程师的教育中,因此本科生将大量参与拟议研究的各个方面。最后,由于Mt Holyoke是一所女子学院,拥有不同寻常的学生群体,因此拟议的研究提供了一个难得的机会,可以扩大代表性不足的学生对科学的参与。
英文摘要
0321449HudgingsJust as the dramatic success of ever more complex silicon integrated circuits has required the development of strategies for detailed on-chip testing and wafer-scale probing, future progress in complex photonic integrated circuits (PICs) will rely on the development of non-invasive techniques for wafer-scale optical profiling of integrated optoelectronics. This proposal is to develop thermoreflectance techniques that will allow us unprecedented access into the propagation of light within complex photonic circuits. The PI will develop a thermal profiling technique using thermoreflectance imaging in combination with a new total energy balance model for external heat exchange that will enable non-contact, three-dimensional thermal imaging with spatial resolution on the order of 100 nm, less than 1 ms temporal resolution, and temperature resolution of 1-100 mK. This is an order of magnitude better than commercial IR microscopes, and it is much faster than liquid crystal thermometry. This state of the art technique will enable the PI to achieve the following technological advances: 1) Noninvasive optical profiling of PICs, 2) Development of a novel technique for extracting carrier temperature distribution from lattice surface temperatures of optoelectronic devices, 3) Three-dimensional thermal imaging, and 4) Measurement of thermal transients inside working optoelectronic devices.This proposal will significantly enhance the infrastructure for research and education by creating a partnership between Mount Holyoke College, a top-20 undergraduate liberal arts college for women and MIT, one of the world's premier technical universities. Furthermore, the proposal integrates research with education at all levels of study: over the duration of the three year research plan, 6-8 undergraduate women students from Mount Holyoke will work on this project, in collaboration with a graduate student from MIT. Mt Holyoke places a particular premium on the integration of cutting-edge research into the education of the next generation of women scientists and engineers, so undergraduates will be heavily involved in all aspects the proposed research. Finally, because Mt Holyoke is a women's college with an unusually diverse student body, the proposed research comprises a remarkable opportunity to broaden the participation of underrepresented students in science.
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