SBIR Phase I: Compact Heat Sink using Microscale Ion Driven Air Flow

这一小型企业创新研究第一阶段项目旨在论证设计和制造微型离子驱动气流散热器的可行性。将消费电子产品的温度保持在可接受的水平所需的散热率正在以指数速度增加。尽管热流密度上升，但由于其低成本和简单性，用空气冷却电子产品仍然是热管理的首选方法。然而，在笔记本电脑等小型便携式电子产品中，传统的散热设备无法达到这些热量传输率。该设备的散热量与传统风扇和散热器相同，但体积只有传统风扇和散热器的十分之一。为了证明这项技术的可行性，将进行一系列有针对性的模型和实验。该计划最终将进行系统级的可行性研究，该研究将通过模型和实验证明该技术冷却电子设备的能力。该项目的商业应用是用于笔记本电脑等小型便携式电子设备的散热器。这项研究的目标是开发和生产一种紧凑型散热器，它将完全无噪音、重量轻、体积小，而且比任何其他风冷散热设备都更便宜。这种散热器将具有广阔的商业潜力，特别是在笔记本电脑、未来的手机和其他移动计算应用中。它将允许在这些小型便携式封装中使用高性能CPU。这也将促进计算机芯片的进一步小型化和集成化。

This Small Business Innovation Research Phase I project proposes to demonstrate the feasibility of designing and fabricating a Microscale Ion Driven Air Flow heat sink device. The heat removal rate required to maintain the temperature of consumer electronics at an acceptable level is increasing at an exponential rate. In spite of the rise in heat fluxes, cooling electronics with air continues to be the preferred method of thermal management because of its low cost and simplicity. However, conventional heat-sinking devices are not able to achieve these heat transfer rates in small portable electronics such as laptop computers. The proposed device has the potential to dissipate the same amount of heat as a conventional fan and heat sink, but in 1/10th the size. To prove the viability of this technology, a series of targeted models and experiments will be run. The program will culminate with a system level feasibility study that will demonstrate, through models and experiments, the ability of this technology to cool electronic equipment.The commercial application of this project is a heat sink for use with small portable electronic devices such as laptop computers. The goal of this research is to develop and produce a compact heat sink that will be completely noiseless, lightweight, smaller and cheaper than any other air-cooled heat-sinking device. The heat sink will have broad commercialization potential, particularly in laptop computers, future cell phones, and other mobile computing applications. It will allow the use of high-performance CPUs in these small portable packages. This will also facilitate further miniaturization and integration of computer chips.