Sensors: Adaptive Fiber Optic Sensor Networks for Monitoring Dynamic Strains

摘要/ abstract摘要：Sridhar krishnaswamynorthwestern university .将开发一种采用新型阵列解调方案的自适应光纤传感器网络来监测动态应变。与扫描解调方法不同，扫描解调方法是顺序探测每个传感器，所提出的方法将使所有光纤传感器始终处于活动状态。传感器网络还将自动适应低频传感器漂移，例如由缓慢结构变形或温度变化引起的漂移，同时保持对动态应变的敏感性。因此，自适应光纤传感器网络可用于监测结构振动、冲击损伤、声发射或故意诱导的超声波信号。该系统的应用包括结构健康监测、过程监测和结构相控阵超声成像。该项目将包括传感器和系统开发、建模以及SHM和过程监控的应用。主要的应用重点将是利用超声波和声发射传感器进行结构健康监测。其他将被探索的应用包括结构缺陷的光声成像，以及聚合物复合材料的过程监控，其中传感器在制造时嵌入到结构中，用于评估复合材料的固化状态。该项目将在材料表征、光学和超声波等跨学科领域培养学生。这是传感器计划NSF04-522下的一个项目。

Abstract0427738 PI: Sridhar KrishnaswamyNorthwester Univ.An adaptive Fiber-Optic Sensor network to monitor dynamic strains using a novel array demodulation scheme will be developed. Unlike scanned-demodulation approaches where each sensor is probed sequentially, the proposed approach will enable all the fiber sensors to be active at all times. The sensor network will also automatically adapt to low-frequency sensor drift such as those induced by slow structural deformation or temperature changes, while retaining sensitivity to dynamic strains. The adaptive fiber-optic sensor network can therefore be used to monitor structural vibration, impact damage, acoustic emissions, or intentionally-induced ultrasonic signals. Applications of such a system include structural health monitoring, process monitoring, and phased-array ultrasonic imaging of structures. The project will include sensor and system development, modeling, and applications to SHM and process monitoring. The primary application focus will be structural health monitoring using ultrasonic and acoustic emission sensors. Other applications that will be explored include photo-acoustic imaging of structures for flaws, and process monitoring of polymer composites where the sensors are embedded into the structure at the time of manufacturing and are used to assess the cure state of the composite. The project will train students in the cross-disciplinary fields of materials characterization, optics, and ultrasonics.This is a project under Sensors Initiative NSF04-522.