Microfabricated Thermoacoustic Refrigerators for Electronics Cooling Applications
Microfabricated Thermoacoustic Refrigerators for Electronics Cooling Applications
批准号:
0524263
负责人:
Jeffrey Vipperman
金额:
$0.0万
依托单位:
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2005
资助国家:
美国
项目状态:
已结题
起止时间:
2005-09-01 至 2007-02-28
中文摘要
ecs - 0524263 j。这项研究的目的是量化微尺度热声制冷机的能力,并确定使用它们冷却微电子设备的可行性限制。方法是建立小型热声装置和相关热交换器的数值模型,以便进行参数分析并确定性能限制。将研究和优化各种设计参数,包括几何形状、操作压力、气体混合物和材料。器件元件将被制造并整合到现有的热声制冷机模型中,以便对数值模型进行实验表征和验证。提出的研究是制造业、科学、教育和工业几个重要需求融合的直接结果。在将热声学应用于电子设备的散热问题上,几乎没有做过任何工作,这为一种简单、高效、环保的冷却方法(不含氯氟烃、氢氯氟烃或其他有害制冷剂)提供了潜力。拟议的工作确定了一种新技术,该技术将允许制造商可靠地为商业和军用电子产品提供更高水平的散热。所提出的技术可以应用于非常多样化的市场:几乎任何包含电子元件的产品都可以通过所提出的研究得到改进。预计该装置也可以用于冷却电子设备以外的目的。
英文摘要
ECS-0524263J. Vipperman, U of PittsburghThe objective of this research is to quantify the capabilities of microscale thermoacoustic refrigerators and establish the feasibility limits of using them to cool microelectronic devices. The approach is to form numerical models of small-scale thermoacoustic devices and associated heat exchangers such that parametric analyses can be performed and performance limits established. Various design parameters will be investigated and optimized, including geometry, operating pressure, gas mixture, and materials. Device elements will be fabricated and incorporated into existing thermoacoustic refrigerator models to permit experimental characterization and verification of the numerical models. The proposed research is the direct result of the convergence of several important needs in manufacturing, science, education, and industry. Little or no work has been done to apply thermoacoustics to the issue of heat removal in electronics, which offers potential for a simple, efficient, and environmentally friendly method of cooling (no chlorofluorocarbons, hydrochlorofluorocarbons, or other harmful refrigerants). The proposed work identifies a novel technology that will allow manufacturers to reliably provide higher levels of heat dissipation from commercial and military electronics. The proposed technology can be applied in very diverse markets: almost any product that incorporates electronic components can be improved by the proposed research. It is anticipated that the device could be used for purposes other than cooling electronics as well.
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批准号:1743649
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项目类别:Standard Grant
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资助金额:$5.0万
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财政年份:2017
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负责人:Jeffrey Vipperman
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依托单位:
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财政年份:2011
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负责人:Jeffrey Vipperman
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依托单位:
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