SBIR Phase I: Three-Phase Nanocomposites for Embedded Capacitors

SBIR 第一阶段：用于嵌入式电容器的三相纳米复合材料

• 批准号: 0539713
• 负责人: Yongdong Jiang
• 金额: $ 10万
• 依托单位: NGIMAT CO.
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2006
• 资助国家: 美国
• 起止时间: 2006-01-01 至 2006-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0539713&HistoricalAwards=false
• 关键词: SBIR; Phase; Three; Nanocomposites; Embedded

This Small Business Innovation Research (SBIR) Phase I project will investigate three-phase nanocomposite films for embedded capacitor applications. There is demand for an embedded capacitor technology that addresses the need for miniaturization and increased functionality of electronic systems. The proposed three phase nanocomposite artificial dielectrics have the potential to have high dielectric constant (300), low leakage current, and high breakdown voltage while maintaining the adhesion, processability, and flexibility of polymers. The shape, size and orientation of nanoparticles in the polymer matrix will be controlled in order to tune the particles' behavior as dielectric enhancers in the insulating matrix. Nanoparticles having spherical, cubic, and wire geometries and dimensions in the range of 5 - 100 nm will be dispersed into polymer resin and formed into thin film capacitors for testing.Polymer matrix nanocomposites have potential as dielectrics for the next generation ofcapacitors. Embedded capacitors are needed in order to meet the projected trends in electronic device miniaturization. Currently, the majority of the board surface is occupied by passive components (70%), with most of these being capacitors (60%). If the capacitors can be embedded in the board itself, the size of the device can be reduced significantly with additional benefits in performance, functionality, and cost. Such practical, high-capacitance materials (20 nF/cm2) will enable embedded capacitors for printed circuit board applications. In addition, high energy density capacitors (1 J/cc) are needed for temporary backup power and pulsed-power in electronics and hybrid vehicles.

这个小企业创新研究（SBIR）第一阶段项目将研究用于嵌入式电容器应用的三相纳米复合薄膜。存在对解决电子系统的小型化和增加的功能性的需要的嵌入式电容器技术的需求。所提出的三相纳米复合人工晶体具有高介电常数（300）、低漏电流和高击穿电压的潜力，同时保持聚合物的粘附性、可加工性和柔性。将控制聚合物基质中的纳米颗粒的形状、尺寸和取向，以调节颗粒作为绝缘基质中的介电增强剂的行为。具有球形、立方体和线状几何形状和尺寸在5 - 100 nm范围内的纳米颗粒将分散到聚合物树脂中并形成用于测试的薄膜电容器。为了满足电子设备小型化的预期趋势，需要嵌入式电容器。目前，电路板表面的大部分被无源元件（70%）占据，其中大部分是电容器（60%）。如果电容器可以嵌入电路板本身，则可以显著减小器件的尺寸，并在性能、功能和成本方面带来额外的好处。这种实用的高电容材料（20 nF/cm 2）将使嵌入式电容器能够用于印刷电路板应用。此外，高能量密度电容器（1 J/cc）需要用于电子和混合动力汽车的临时备用电源和脉冲电源。