Tin Whiskers Mitigation Strategy through Composite Tin Plating with Ni-nanoparticles

本研究的主要目的是了解复合镀锡对锡须形核与生长的影响。 检查该目标的方法如下：1）开发一种制造复合阳极的方法，该复合阳极由作为基质的锡和作为增强物的镍纳米颗粒组成，所述镍纳米颗粒将均匀地分布在锡基质中。2)找到一种最佳的化学溶液，在电镀过程中将锡和镍纳米颗粒从阳极平行输送到阴极。3)发展加速锡晶须成核与成长之程序。4)研究镍纳米颗粒对影响锡晶须成核和生长的机制的影响，例如类型，强度和内应力来源，镍纳米颗粒的存在和扩散过程。 各种技术，包括X射线衍射，聚焦离子束，扫描俄歇显微镜，和扫描电子显微镜将被用来研究晶须生长动力学和镍纳米粒子的存在对其生长的影响。在锡中加入镍纳米粒子，可以阻止晶须的生成和生长，改变钎料与基体的界面，从而显著改变焊点的形貌。如果成功，这项研究将为电子元件和组件的制造商/用户提供一种环保的镀锡技术，通过消除锡晶须形式的导电丝的生长，大大降低电子元件和组件的可靠性风险问题。 该项目将在与材料科学、电镀和电物理机械性能测试有关的研究、培训和教育方面产生新的方向。

The main objective of this research project is to understand the effect of composite tin plating on the nucleation and growth of tin whiskers. The approach to examining this objective is the following: 1) Develop a process to fabricate a composite anode that consists of tin as a matrix and nickel nanoparticles as a reinforcement that would be uniformly distributed through the tin-matrix. 2) Find an optimal chemical solution that will provide a parallel transport of tin and nickel nanoparticles from the anode to the cathode in the electroplating process. 3) Develop a procedure for accelerated nucleation and growth of tin whiskers. 4) Study the effect of nickel nanoparticles on the mechanisms that affect the nucleation and growth of tin whiskers, such as type, intensity, and source of internal stresses, the presence of nickel underlay, and the diffusion process. Various techniques, including x-ray diffraction, focused ion beam, scanning auger microscopy, and scanning electron microscopy will be used to study the whisker growth kinetics and effect of the presence of nickel nanoparticles on its growth. The addition of Nickel nanoparticles to tin will change drastically the morphology of the solder joint by blocking the initiation and growth of whiskers as well as change the interface between solder and substrates. If successful, this research will provide manufacturers/users of electronic components and assemblies with an environmentally friendly tin-plating technology that will drastically decrease reliability risk issue of electronic components and assemblies by eliminating the growth of electrically conductive filaments in the form of tin whiskers. The project will generate new directions in research, training and education related to materials science, electroplating, and the testing of electro-physical-mechanical properties.