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SGER: Dynamic hardware adaptation of high performance CMPs for managing thermal hotspots

SGER: Dynamic hardware adaptation of high performance CMPs for managing thermal hotspots
SGER:高性能 CMP 的动态硬件适配,用于管理热点
批准号:
0649824
负责人:
Sandip Kundu
金额:
$0.0万
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2006
资助国家:
美国
项目状态:
已结题
起止时间:
2006-10-01 至 2009-03-31

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中文摘要
翻译
CCF-0649824标题:SGER-用于管理热热点的高性能CMPS的动态硬件适配PI:Kundu,SandipInst:马萨诸塞大学阿默斯特摘要随着晶体管尺寸的缩小,单位面积上集成的器件越来越多,从而提高了单位面积上芯片的功耗和散热。在处理器上执行的软件程序可以被定制为在芯片的特定区域上创建热热点。CMOS电路的性能取决于温度。由于温度变化引起的信号竞争,热点引起的大温差往往会导致功能故障。热点还会导致长期的可靠性问题。在本提案中,我们通过监控软件执行、测量软件执行时的温度变化率、预测潜在问题并通过各种拦截方法(包括电压和频率控制、挂起、将线程切换到不同的内核等)来解决多核处理器的这一问题。监控进程在相同的多核处理器上执行,并且对操作系统或应用程序隐藏。这种监控和适配硬件的方案
英文摘要
CCF - 0649824Title: SGER - Dynamic hardware adaptation of high performance CMPs for managing thermal hotspotsPI: Kundu, SandipInst: University of Massachusetts AmherstAbstractAs the transistor dimensions shrink, more devices are integrated per unit area, driving up power consumption and heat dissipation of a chip on a per unit area basis. A software program executing on a processor can be tailored to create a thermal hot spot on a specific area of a chip. Performance of CMOS circuits depends on temperature. Large temperature differentials caused by hot spots often result in functional failures due to signal race introduced by such changes in temperature. Hot spots also cause long term reliability problems. In this proposal, we are addressing this problem for a multi-core processor by monitoring software execution, measuring the rate of change of temperature as the software executes, predicting potential problems and avoiding them by various intercept methods including voltage and frequency control, suspension, switching thread to a different core etc. The monitoring process executes on the same multi-core processors and is hidden from operating systems or applications. This scheme of monitoring and adapting the hardware
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