Improving Reliability and Availability of Chip Multiprocessors

摘要声明提案ID： 0811467提案标题： 提高单片多处理器的可靠性和可用性--马萨诸塞州大学的Sandip Kundu 基瓦尔湾威斯康星州大学的萨卢加？麦迪逊 James E.威斯康星州大学的史密斯？Madison提案期：2008年6月至2010年5月摘要：这是一个多大学项目。该提案的中心思想是开发和使用一个？显微镜层？它位于操作系统和微处理器硬件之间。其目的是提供所需的系统性能，即使系统中的某些组件无法满足其指定的目标。特别地，本研究着重于使用微电压层来保护处理器免受过热或用于测试和诊断处理器中的故障，以提高微处理器和基于微处理器的系统的可靠性和可用性。该项目将量化实施这样一个计划的优势和成本。这项研究的更广泛的技术和学术影响是通过网络共享向学术界和工业界提供这项研究的结果。结果将对半导体行业大有裨益，因为该提案解决了即将到来的可靠性问题。创新将通过以更低的成本生产更高性能、高可靠性的计算资源来提高美国的竞争力，从而为社会提供巨大的社会经济效益。

Summary StatementProposal ID: 0811467 Proposal Title: Improving Reliability and Availability of Chip MultiprocessorsInvestigators: Sandip Kundu of University of Massachusetts Kewal K. Saluja of University of Wisconsin ? Madison James E. Smith of University of Wisconsin ? MadisonProposal Period: June 2008 to May 2010 Summary: This is a multi-university project. The central idea of the proposal is to develop and use a ?microvisor layer? that resides between operating system and the hardware of a microprocessor. The objective is to provide the desired system performance even when some of the components in the system are unable to meet their specified goals. In particular this study focuses on the use of microviosor layer to protect the processor from overheating or for testing and diagnosis of faults in the processor so as to improve the reliability and availability of a microprocessor and microprocessor based system. The project will quantify the advantages and the cost of implementing such a scheme.The broader technological and academic impact of this research is availability of results of this research to academia and industry though web share. The results will be of great benefit to the semiconductor industry as the proposal addresses reliability problems that are just around the corner. Innovations will help US competitiveness by producing higher performance, high reliability computing resources at lower cost, thus providing a great socioeconomic benefit to the society.