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Improving Reliability and Availability of Chip Multiprocessors

提高芯片多处理器的可靠性和可用性

基本信息

批准号：
0811467
负责人：
Sandip Kundu
金额：
$ 14.96万
依托单位：
University of Massachusetts Amherst
依托单位国家：
美国
项目类别：
Standard Grant
财政年份：
2008
资助国家：
美国
起止时间：
2008-08-01 至 2011-07-31
项目状态：
已结题

来源：
https://www.nsf.gov/awardsearch/showAward?AWD_ID=0811467&HistoricalAwards=false
关键词：
Improving Reliability Availability Chip Multiprocessors

项目摘要

Summary StatementProposal ID: 0811467 Proposal Title: Improving Reliability and Availability of Chip MultiprocessorsInvestigators: Sandip Kundu of University of Massachusetts Kewal K. Saluja of University of Wisconsin ? Madison James E. Smith of University of Wisconsin ? MadisonProposal Period: June 2008 to May 2010 Summary: This is a multi-university project. The central idea of the proposal is to develop and use a ?microvisor layer? that resides between operating system and the hardware of a microprocessor. The objective is to provide the desired system performance even when some of the components in the system are unable to meet their specified goals. In particular this study focuses on the use of microviosor layer to protect the processor from overheating or for testing and diagnosis of faults in the processor so as to improve the reliability and availability of a microprocessor and microprocessor based system. The project will quantify the advantages and the cost of implementing such a scheme.The broader technological and academic impact of this research is availability of results of this research to academia and industry though web share. The results will be of great benefit to the semiconductor industry as the proposal addresses reliability problems that are just around the corner. Innovations will help US competitiveness by producing higher performance, high reliability computing resources at lower cost, thus providing a great socioeconomic benefit to the society.

提案ID: 0811467提案标题：提高芯片多处理器的可靠性和可用性研究人员：麻省大学的Sandip Kundu，威斯康星大学的Kewal K. Saluja威斯康星大学的麦迪逊·詹姆斯·e·史密斯？摘要：这是一个由多所大学合作的项目。该提案的中心思想是开发和使用一个？microvisor层?它位于操作系统和微处理器硬件之间。目标是提供所需的系统性能，即使系统中的某些组件无法满足其指定的目标。特别地，本研究侧重于使用微处理器层来保护处理器免受过热或用于处理器故障的测试和诊断，从而提高微处理器和基于微处理器的系统的可靠性和可用性。该项目将量化实施这一计划的优势和成本。这项研究的更广泛的技术和学术影响是，研究结果可以通过网络共享给学术界和工业界。这一结果将对半导体行业大有裨益，因为该提案解决了即将出现的可靠性问题。创新将以更低的成本生产出性能更高、可靠性更高的计算资源，从而提高美国的竞争力，从而为社会提供巨大的社会经济效益。