Thermal-Aware Multiprocessor System-On-chip Synthesis

热感知多处理器片上系统综合

• 批准号: 0702761
• 负责人: Robert Dick
• 金额: $ 27.5万
• 依托单位: Northwestern University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2007
• 资助国家: 美国
• 起止时间: 2007-09-01 至 2010-10-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0702761&HistoricalAwards=false
• 关键词: Thermal; Aware; Multiprocessor; System; chip

Proposal ID: 0702761PI name: Robert DickTitle: Thermal-Aware Multiprocessor System-On-chip SynthesisInstitution: Northwestern UniversityABSTRACT:Embedded systems are application-specific computers within other devices such as consumer electronics, automobiles, medical devices, or networks of sensors used to monitor the safety of buildings and the health of wildlife. Many embedded systems are now implemented almost entirely on a multiprocessor system-on-chip (MPSoC), a single integrated circuit chip containing a complex network of microprocessors. In high-performance applications, the critical limiter on computation speed is temperature. Designing MPSoCs is a difficult task because the each application imposes different requirements. In this project, the PIs plan to develop methods of accurately predicting the impacts of MPSoC design decisions on temperature, functionality, price, and power consumption. We will also develop methods of automatically designing MPSoCs that are well suited to particular applications. The planned work will focus on ideas that can be widely re-used in many different MPSoC applications. An estimate is that system-on-chip market is projected to reach $170 billion by 2007. The project will hopefully work to encourage industry to adopt the most promising new design and automated design techniques developed in this project by collaborating with our industrial affiliates on design projects and by teaching new design techniques to students who will later join industry.

提案ID：0702761PI名称：Robert DickTitle：热感知多处理器片上系统合成机构：西北大学摘要：嵌入式系统是其他设备内的专用计算机，如消费电子产品、汽车、医疗设备或传感器网络，用于监控建筑物的安全和野生动物的健康。许多嵌入式系统现在几乎完全在多处理器片上系统(MPSoC)上实现，MPSoC是包含复杂的微处理器网络的单个集成电路芯片。在高性能应用中，计算速度的关键限制因素是温度。设计MPSoC是一项困难的任务，因为每种应用都有不同的要求。在该项目中，PI计划开发准确预测MPSoC设计决策对温度、功能、价格和功耗的影响的方法。我们还将开发适合特定应用的自动设计MPSoC的方法。计划中的工作将集中在可以在许多不同的MPSoC应用中广泛重复使用的想法。据估计，到2007年，片上系统市场预计将达到1700亿美元。该项目希望通过与我们的工业附属公司在设计项目上合作，并通过向以后加入行业的学生教授新的设计技术，来鼓励行业采用在该项目中开发的最有前途的新设计和自动化设计技术。