STTR Phase I: Metamaterial-Based Antennas for Miniaturized Multi-Band Wireless Systems

STTR 第一阶段：用于小型化多频段无线系统的基于超材料的天线

• 批准号: 0711825
• 负责人: Jesus Castaneda
• 金额: $ 15万
• 依托单位: Bridge Wave Electronics
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2007
• 资助国家: 美国
• 起止时间: 2007-07-01 至 2008-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0711825&HistoricalAwards=false
• 关键词: STTR; Phase; Metamaterial; Based; Antennas

This Small Business Technology Transfer (STTR) Phase I research project explores novel wireless antenna technologies based on one or two dimensional metamaterial structures. The basic approach is to compress, twist, and fragment (CTF) metal strips or discs in a multi-layer structure to form self-tuned, bandwidth optimized, and miniaturized antennas. A concept of dispersion band engineering is introduced in this project to facilitate the antenna design. By tailoring the transmission band characteristics through the use of three-dimensional (3D) substrate metallization, it is possible to reduce guide-wavelength dramatically while maintaining low dispersion. The metallized materials comprise possibly high-density localized vias and metal films within multiple dielectric layers in printed circuit structures. This project investigates new integrated antennas evolved from such structures. Wireless communications continue to demand compact power efficient multi-standard and multi-functional systems where the antenna has been a salient component and the bottleneck for miniaturization and broadband applications. The proposed concept of 3D volume integrated circuits to replace conventional planar integrated circuits will have broader impact on RF communication systems. The proposed low-cost single-band antenna solution could have direct impact on dimension reduction of GSM mobile phones. The new idea of one antenna for all should have an immediate market demand on WLAN enhanced GSM phones. The product could expand into other wireless networks, such as global satellite navigation, radio-frequency identification (RFID), and paging systems.

这项小型企业技术转移(STTR)第一阶段研究项目探索基于一维或二维超材料结构的新型无线天线技术。基本方法是在多层结构中压缩、扭曲和破碎(CTF)金属条或盘，以形成自调谐、带宽优化和小型化的天线。为了方便天线的设计，在本项目中引入了频带工程的概念。通过使用三维(3D)衬底金属化来定制传输频带特性，可以在保持低色散的同时显著减少导波波长。金属化材料在印刷电路结构中的多个电介质层内可能包括高密度的局域化过孔和金属膜。该项目研究由这种结构演变而来的新型集成天线。无线通信继续要求紧凑、节能、多标准和多功能的系统，其中天线已经成为小型化和宽带应用的重要组成部分和瓶颈。3D体集成电路取代传统平面集成电路的概念将对射频通信系统产生更广泛的影响。提出的低成本单频天线解决方案可能会对GSM手机的降维产生直接影响。所有人一根天线的新想法应该会在WLAN增强型GSM手机上立即产生市场需求。该产品可以扩展到其他无线网络，如全球卫星导航、射频识别(RFID)和寻呼系统。