SBIR Phase I: Abraisve Free Chemical Mechanical Planarization (AFCMP) Process for Next Generation Copper Interconnects

这项小型企业创新研究（SBIR）一期项目提出了一种基于独特的专利碘化学的新型无磨料可回收铜CMP （AFCMP）可回收工艺的开发，该工艺可在铜表面形成柔软的不溶性碘化铜层。这一层可以用抛光垫轻轻去除，而不需要浆液中的颗粒（无磨料的浆液）。该工艺与传统的CMP工艺相反，传统的CMP工艺（通过添加过氧化氢）形成坚硬的氧化铜层，这需要蚀刻化学品和硬磨料（氧化铝/二氧化硅）来去除。相比之下，碘化铜层的硬度几乎小一个数量级，因此可以很容易地被聚合物抛光垫去除。废水中不溶性的碘化铜可以通过过滤去除，化学品可以回收用于CMP抛光。该项目将尝试成功演示(i)使用无磨料的ecmp浆料抛光铜，以满足当前的技术要求，（ii） afcmp浆料与下一代超低k介电材料的兼容性，（iii）过滤能力，并与过滤浆料保持一致的性能。低k互连和AFCMP的快速集成有望带来可观的利润和节能。环境友好型制造业，增加高科技岗位。美国将成为铜低钾CMP技术的领导者；美国的半导体公司将在当地拥有一家浆料供应商。确保美国在纳米技术领域的领导地位。

This small business innovation research (SBIR) Phase I project proposes the developmentof a novel abrasive-free recyclable copper CMP (AFCMP) recyclable process based onan unique patented iodine chemistry which leads to the formation of a soft, insolublecopper iodide layer on the surface of the copper. This layer can be gently removed by thepolishing pad without the need for particles in the slurry (abrasive-free slurry). Thisprocess is in contrast to conventional CMP processes that forms a hard copper oxide layer(by addition of hydrogen peroxide), which require both etching chemicals and hardabrasives (alumina/silica) for removal. In contrast, the copper iodide layer possess nearlyan order of magnitude less hardness, thus can be easily removed by the polymer polishingpad. The insoluble copper-iodide in the effluents can be removed by filtration and thechemicals can be recycled back for CMP polishing. This project will attempt successful demonstration of (i) copper polishing using abrasive-freeCMP slurries to meet present technical requirements, (ii) compatibility of AFCMPslurries to next generation ultra-low k dielectrics materials, (iii) the ability to filter andobtain consistent performances with the filtrate slurries.The rapid integration of low k interconnects and AFCMP is expected to lead tosubstantial profits and energy savings. Environmental friendly manufacturing, andincrease in hi-tech jobs. US will be a leader in copper low k CMP technology; and USbased semiconductor companies will have a local slurry supplier. Ensure US leadershipin nanotechnology.