SBIR Phase I: Low Dielectric Fiber for High Frequency Circuit Board Applications

SBIR 第一阶段：用于高频电路板应用的低介电纤维

• 批准号: 0712117
• 负责人: Brian Morin
• 金额: --
• 依托单位: Innegrity LLC
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2007
• 资助国家: 美国
• 起止时间: 2007-07-01 至 2008-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0712117&HistoricalAwards=false
• 关键词: SBIR; Phase; Low; Dielectric; Fiber

The Small Business Innovation Research (SBIR) Phase I project will assess the feasibility of using blends of polymers to make high strength, low dielectric fibers to be used as reinforcements with glass fiber in high frequency circuit board substrate materials. The innovation will allow a reduction in the dielectric constant of 42% (from 5.2 to 3.0) and dielectric loss of 80% (from 0.025 to 0.005) in high frequency circuit board substrates when compared to FR-4 circuit board materials. In addition, the density of the board materials will be decreased by 35%, lowering the weight in mobile and transportation applications. While blends of polymer materials are common, those chosen for the proposed research are particularly interesting not only for the proposed application, but also for the technical challenges inherent in the chosen strategy. Specifically, the research proposes to blend miscible polymers, one of which is amorphous and the other semi-crystalline. While the processing temperature ranges overlap, the high shear environment of fiber spinning should provide for interesting science as well as a strong commercial need. If successful, the fibers will provide for a low cost, light weight reinforcement which can provide significant benefit to high frequency circuit board materials in applications ranging from high speed computing to mobile communications.

小企业创新研究（SBIR）第一阶段项目将评估使用聚合物共混物制造高强度、低介电纤维的可行性，这些纤维将与玻璃纤维一起用作高频电路板基板材料的增强材料。 与FR-4电路板材料相比，该创新将使高频电路板基板的介电常数降低42%（从5.2降至3.0），介电损耗降低80%（从0.025降至0.005）。 此外，板材料的密度将降低35%，降低了移动的和运输应用的重量。虽然聚合物材料的共混物是常见的，但为拟议的研究选择的那些材料不仅对于拟议的应用特别有趣，而且对于所选策略中固有的技术挑战也特别有趣。 具体地说，该研究提出了共混混的聚合物，其中之一是无定形和其他半结晶。 虽然加工温度范围重叠，但纤维纺丝的高剪切环境应提供有趣的科学以及强大的商业需求。 如果成功的话，该纤维将提供一种低成本、重量轻的增强材料，这可以在从高速计算到移动的通信的应用中为高频电路板材料提供显著的益处。