SBIR Phase I: Low Dielectric Fiber for High Frequency Circuit Board Applications

小企业创新研究（SBIR）第一阶段项目将评估使用聚合物混合物制造高强度低介电纤维的可行性，这些纤维用于高频电路板基板材料中的玻璃纤维增强。与FR-4电路板材料相比，该创新将使高频电路板衬底的介电常数降低42%（从5.2到3.0），介电损耗降低80%（从0.025到0.005）。此外，板材料的密度将降低35%，降低了移动和运输应用中的重量。虽然高分子材料的共混物很常见，但所选择的研究材料特别有趣，不仅因为所建议的应用，而且因为所选择的策略中固有的技术挑战。具体来说，本研究提出共混一种非晶半晶聚合物。虽然加工温度范围重叠，但纤维纺丝的高剪切环境应该提供有趣的科学和强烈的商业需求。如果成功，这种纤维将提供低成本、轻重量的增强材料，可以为从高速计算到移动通信等应用中的高频电路板材料提供显著的好处。

The Small Business Innovation Research (SBIR) Phase I project will assess the feasibility of using blends of polymers to make high strength, low dielectric fibers to be used as reinforcements with glass fiber in high frequency circuit board substrate materials. The innovation will allow a reduction in the dielectric constant of 42% (from 5.2 to 3.0) and dielectric loss of 80% (from 0.025 to 0.005) in high frequency circuit board substrates when compared to FR-4 circuit board materials. In addition, the density of the board materials will be decreased by 35%, lowering the weight in mobile and transportation applications. While blends of polymer materials are common, those chosen for the proposed research are particularly interesting not only for the proposed application, but also for the technical challenges inherent in the chosen strategy. Specifically, the research proposes to blend miscible polymers, one of which is amorphous and the other semi-crystalline. While the processing temperature ranges overlap, the high shear environment of fiber spinning should provide for interesting science as well as a strong commercial need. If successful, the fibers will provide for a low cost, light weight reinforcement which can provide significant benefit to high frequency circuit board materials in applications ranging from high speed computing to mobile communications.