SBIR Phase II: Low Dielectric Fiber for High Frequency Circuit Board Applications

SBIR 第二阶段：用于高频电路板应用的低介电纤维

• 批准号: 0823014
• 负责人: Brian Morin
• 金额: $ 50万
• 依托单位: Innegrity LLC
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2008
• 资助国家: 美国
• 起止时间: 2008-08-01 至 2010-10-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0823014&HistoricalAwards=false
• 关键词: SBIR; Phase; II; Low; Dielectric

This Small Business Innovation Research (SBIR) Phase II project aims to develop the production and application of low dielectric fibers for use in high frequency circuit board applications. As the frequency of digital communications approaches the frequency at which microwave ovens work, the importance of the dielectric properties of the substrate material on which digital circuits are formed is becoming of critical importance. This project will use material and processing strategies to increase the physical properties and reduce the cost of fibers based on cyclic olefin copolymers. These fibers will be woven into fabrics and made into prototype circuit board materials to show their utility. The anticipated results of the project is a fully developed fiber which is ready to be commercialized which can be combined with glass fiber to reduce the dielectric constant and dielectric loss of high frequency circuit board substrate materials, but in all other ways is compatible with processes and materials used to manufacture these circuits. The broader impact/commercial potential will be the achievement of processing blends of amorphous and semi-crystalline polymers in fiber extrusion at speeds approaching 2 kilometers per minute. If successful, this project will introduce a low cost material that enables further advances in digital data processing and communication, with all the incumbent benefits, doing so with reduced energy dissipation in the circuit board materials. The materials are also lighter weight than their glass fiber predecessors, and therefore reduce the weight of mobile electronic and communication devices.

这个小企业创新研究（SBIR）第二阶段项目旨在开发用于高频电路板应用的低介电纤维的生产和应用。随着数字通信的频率接近微波炉的工作频率，形成数字电路的衬底材料的介电特性变得至关重要。该项目将使用材料和加工策略来提高基于环烯烃共聚物的纤维的物理性能并降低成本。这些纤维将被编织成织物，并制成原型电路板材料，以展示它们的实用性。该项目的预期结果是一种完全开发的纤维，可以准备商业化，可以与玻璃纤维结合，以降低高频电路板衬底材料的介电常数和介电损耗，但在所有其他方面与用于制造这些电路的工艺和材料兼容。更广泛的影响/商业潜力将是在纤维挤压中以接近每分钟2公里的速度加工非晶和半晶聚合物的混合物。如果成功，该项目将引入一种低成本材料，使数字数据处理和通信进一步发展，并具有现有的所有优势，从而减少电路板材料的能量消耗。这种材料的重量也比玻璃纤维轻，因此可以减轻移动电子和通信设备的重量。