SBIR Phase I: A Non-Destructive Sensor Platform for Chemical Activity Assessment on Reactive Surfaces

这个小型企业创新研究(SBIR)第一阶段研究项目将展示一种新的传感器平台，用于以非破坏性的方式实时测量活性表面活动。这些涂层的共同特征之一是具有活性元素或化合物。在处理这些层时，除非对选定的样品进行破坏性测试，否则通常很难评估反应层的活性。这种涂层薄膜和表面的常见检测技术包括光学、电学和厚度分析，这些分析能够确定反应层元素的存在和位置。然而，这些经典过程都不能满足反应表面的基本要求，即它的化学活性和反应倾向。这项研究将展示一种新的传感器平台，用于连续和非破坏性地测量反应表面的实时活性。从电池和燃料电池到用于生物和化学破坏或检测的生物涂层薄膜，活性表面正越来越多地被用于产品中。这种传感器方法可以帮助制造工艺可靠地制造反应性表面。该技术方法适用于连续制造反应膜或层的大批量制造方法。使用这种方法，可以在薄膜进一步加工成更高价值的产品之前量化这些反应薄膜的活性。这将有助于提高制造业产量并降低成本。

This Small Business Innovation Research (SBIR) Phase I research project will demonstrate a new sensor platform for measuring reactive surface activity in real time in a non-destructive manner. One of the common features to these coatings is a reactive element or compound. In processing these layers it is often difficult to assess the activity of the reactive layer unless destructive tests are used on selected samples. Common inspection techniques for such coated films and surfaces include optical, electrical, and thickness analyses that are capable of determining the presence and location of the reactive layer elements. However, none of these classical processes are capable of addressing the fundamental requirement of a reactive surface, its chemical activity and propensity for reacting. This research will demonstrate a new sensor platform for measuring the real-time activity of reactive surfaces in a continuous and non-destructive manner. Reactive surfaces are increasingly being used in products ranging from batteries and fuel cells to bio-coated films used for bio and chemical destruction or detection. This sensor approach can help the manufacturing process for reliably fabricating reactive surfaces. The technical approach is amenable to high volume manufacturing methods where reactive films or layers are continuously fabricated. With this approach, these reactive film activities can be quantified before the films are processed further into higher value products. This will help improve manufacturing yields and reduce costs.