STTR Phase II: Hybrid Integrated Optoelectronic Systems

STTR 第二阶段：混合集成光电系统

• 批准号: 0750506
• 负责人: Kevin Curtis
• 金额: --
• 依托单位: InPhase Technologies
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2008
• 资助国家: 美国
• 起止时间: 2008-03-01 至 2010-02-28
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0750506&HistoricalAwards=false
• 关键词: STTR; Phase; II; Hybrid; Integrated

This Small Business Technology Transfer (STTR) Phase II project will combine advanced two-chemistry photopolymer science and 3D maskless lithography to demonstrate a solution to a ubiquitous barrier to the broader impacts of optical and optoelectronic technologies. This research will strive for a universal integration platform capable of seamlessly hybridizing electronic, micro-mechanical, opto-electronic and optic devices on a single chip to implement complex 3D systems in an environmentally robust package. Over 90% of the development cost of optoelectronic components for telecom is estimated to be packaging and the limited market penetration of MEMs products is universally blamed on packaging difficulties clearly showing the need for the proposed platform. In this program the team will optimize the photo polymerizable monomer system and adapt a multi-beam direct-write lithography platform in order to demonstrate and optimize a new class of 3D routed waveguides. Anticipated results are a new class of polymer material and an associated maskless lithography technique to support research, education and commercial production of a wide range of miniature mobile devices that are currently confined to laboratory benches.If successful the proposed multi-disciplinary materials and lithography research program has the potential to revolutionize public access to complex microdevices that are currently restricted to laboratories or expensive military systems. By providing a platform for inexpensive, robust miniaturization of systems that seamlessly incorporate optics, MEMs and electronics, a wide range of communication, medical and sensing systems become technically and economically feasible.

该小型企业技术转让 (STTR) 第二阶段项目将结合先进的双化学光聚合物科学和 3D 无掩模光刻技术，展示解决光学和光电技术影响更广泛的普遍障碍的解决方案。这项研究将致力于建立一个通用集成平台，能够在单个芯片上无缝混合电子、微机械、光电和光学器件，从而在环境稳定的封装中实现复杂的 3D 系统。据估计，电信光电元件 90% 以上的开发成本都在封装上，而 MEM 产品的市场渗透率有限，人们普遍将其归咎于封装困难，这清楚地表明了对拟议平台的需求。在该项目中，该团队将优化光聚合单体系统并采用多光束直写光刻平台，以演示和优化新型 3D 路由波导。预期的结果是一类新型聚合物材料和相关的无掩模光刻技术，以支持目前仅限于实验室工作台的各种微型移动设备的研究、教育和商业生产。如果成功，拟议的多学科材料和光刻研究计划有可能彻底改变公众对目前仅限于实验室或昂贵的军事系统的复杂微型设备的使用。通过为无缝整合光学、MEM 和电子器件的廉价、稳健的小型化系统提供平台，广泛的通信、医疗和传感系统在技术和经济上都变得可行。