STTR Phase II: Hybrid Integrated Optoelectronic Systems

这个小型企业技术转移（STTR）第二阶段项目将结合先进的双化学光聚合物科学和3D无掩膜光刻技术，展示一种解决方案，以解决普遍存在的光学和光电子技术的更广泛影响。这项研究将努力开发一个通用集成平台，能够在单个芯片上无缝地混合电子、微机械、光电和光学设备，从而在环境坚固的封装中实现复杂的3D系统。据估计，超过90%的电信光电子元件开发成本用于封装，MEMs产品的有限市场渗透率普遍归咎于封装困难，这清楚地表明了对拟议平台的需求。在这个项目中，团队将优化光聚合单体系统，并采用多光束直写光刻平台，以演示和优化新型3D路由波导。预期的结果是一种新型聚合物材料和相关的无掩模光刻技术，以支持目前局限于实验室工作台的各种微型移动设备的研究、教育和商业生产。如果成功，该多学科材料和光刻研究计划有可能彻底改变公众对复杂微设备的访问，这些设备目前仅限于实验室或昂贵的军事系统。通过为无缝集成光学、MEMs和电子系统的廉价、强大的系统小型化提供平台，广泛的通信、医疗和传感系统在技术和经济上变得可行。

This Small Business Technology Transfer (STTR) Phase II project will combine advanced two-chemistry photopolymer science and 3D maskless lithography to demonstrate a solution to a ubiquitous barrier to the broader impacts of optical and optoelectronic technologies. This research will strive for a universal integration platform capable of seamlessly hybridizing electronic, micro-mechanical, opto-electronic and optic devices on a single chip to implement complex 3D systems in an environmentally robust package. Over 90% of the development cost of optoelectronic components for telecom is estimated to be packaging and the limited market penetration of MEMs products is universally blamed on packaging difficulties clearly showing the need for the proposed platform. In this program the team will optimize the photo polymerizable monomer system and adapt a multi-beam direct-write lithography platform in order to demonstrate and optimize a new class of 3D routed waveguides. Anticipated results are a new class of polymer material and an associated maskless lithography technique to support research, education and commercial production of a wide range of miniature mobile devices that are currently confined to laboratory benches.If successful the proposed multi-disciplinary materials and lithography research program has the potential to revolutionize public access to complex microdevices that are currently restricted to laboratories or expensive military systems. By providing a platform for inexpensive, robust miniaturization of systems that seamlessly incorporate optics, MEMs and electronics, a wide range of communication, medical and sensing systems become technically and economically feasible.