STTR Phase I: Hybrid Integrated Optoelectronic Systems

这个小企业技术转让（STTR）第一阶段研究项目将结合联合收割机先进的双化学光聚合物科学和3D无掩模光刻，以展示一个解决方案，以解决光电和MEMS技术广泛影响的普遍障碍。本研究的目标是一个通用的集成平台，能够在单个芯片上无缝地混合电子，微机械，光电和光学器件，以实现复杂的3D系统在一个环境稳健的封装。对这样一个平台的需求是巨大的：超过90%的电信光电元件的开发成本估计是封装和MEMS产品的有限的市场渗透普遍归咎于封装困难。在这个项目中，我们将优化光聚合单体系统，并采用多光束直写光刻平台，以展示和优化一类新的3D路由波导。预期的结果是一类新的聚合物材料和相关的无掩模光刻技术，以支持研究，教育和商业生产的广泛的微型移动的设备，目前仅限于实验室工作台。如果成功的建议多-一个学科材料和光刻研究计划有可能彻底改变目前仅限于实验室或昂贵的复杂微器件的公众访问军事系统。通过提供一个平台，用于无缝集成光学器件、MEMS和电子器件的系统的廉价、稳健的小型化，各种通信、医疗和传感系统在技术上和经济上都变得可行。

This Small Business Technology Transfer (STTR) Phase I research project will combine advanced two-chemistry photopolymer science and 3D maskless lithography to demonstrate a solution to an ubiquitous barrier to the broader impacts of optoelectronic and MEMs technologies. The objective of this research is a universal integration platform capable of seamlessly hybridizing electronic, micro-mechanical, opto-electronic and optic devices on a single chip to implement complex 3D systems in an environmentally robust package. The need for such a platform is enormous: over 90% of the development cost of optoelectronic components for telecom is estimated to be packaging and the limited market penetration of MEMs products is universally blamed on packaging difficulties. In this program, we will optimize the photo polymerizable monomer system and adapt a multi-beam direct-write lithography platform in order to demonstrate and optimize a new class of 3D routed waveguides. The anticipated results are a new class of polymer material and an associated maskless lithography technique to support research, education and commercial production of a wide range of miniature mobile devices that are currently confined to laboratory benches.If successful the proposed multi-disciplinary materials and lithography research program has the potential to revolutionize public access to complex microdevices that are currently restricted to laboratories or expensive military systems. By providing a platform for inexpensive, robust miniaturization of systems that seamlessly incorporate optics, MEMs and electronics, a wide range of communication, medical and sensing systems become technically and economically feasible.