SBIR Phase I: Repair and Manufacturing of Integrated Circuit Probe Cards through Innovations in Electrochemical Printing

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This Small Business Innovation Research Phase I Project is to develop Electrochemical Printing technology for the repair of integrated circuit (IC) test probe cards. Electrochemical Printing (EcP) will be developed as a tool for repairing and manufacturing small quantities of high value metal micro-structures on probe cards. EcP is a maskless solid freeform fabrication technique that electrodeposits dense metal micro-scale patterns beneath a rastering microjet print nozzle. The broader impact of this research is to provide an economical means of repair for probe cards that are currently scrapped.