SBIR Phase I: Repair and Manufacturing of Integrated Circuit Probe Cards through Innovations in Electrochemical Printing

SBIR 第一阶段：通过电化学印刷创新修复和制造集成电路探针卡

• 批准号: 0810466
• 负责人: Jeffrey Nelson
• 金额: --
• 依托单位: Ionographics, Incorporated
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2008
• 资助国家: 美国
• 起止时间: 2008-07-01 至 2009-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0810466&HistoricalAwards=false
• 关键词: SBIR; Phase; Repair; Manufacturing; Integrated

This Small Business Innovation Research Phase I Project is to develop Electrochemical Printing technology for the repair of integrated circuit (IC) test probe cards. Electrochemical Printing (EcP) will be developed as a tool for repairing and manufacturing small quantities of high value metal micro-structures on probe cards. EcP is a maskless solid freeform fabrication technique that electrodeposits dense metal micro-scale patterns beneath a rastering microjet print nozzle. The broader impact of this research is to provide an economical means of repair for probe cards that are currently scrapped.

这个小型企业创新研究第一阶段项目是开发用于修复集成电路(IC)测试探针卡的电化学印刷技术。电化学印刷(ECP)将被开发为一种修复和制造探针卡上少量高价值金属微结构的工具。ECP是一种无掩膜的固体自由形状制造技术，它将致密的金属微尺度图形电沉积在光栅式微喷打印喷嘴下。这项研究的更广泛的影响是为目前报废的探针卡提供一种经济的修复方法。