SBIR Phase II: Manufacturing of Package Test Socket Contactors through Innovations in Electrochemical Printing

SBIR 第二阶段：通过电化学印刷创新制造封装测试插座接触器

• 批准号: 0923856
• 负责人: Jeffrey Nelson
• 金额: $ 50万
• 依托单位: Ionographics, Incorporated
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2009
• 资助国家: 美国
• 起止时间: 2009-08-01 至 2012-01-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0923856&HistoricalAwards=false
• 关键词: SBIR; Phase; II; Manufacturing; Package

This award is funded under the American Recovery and Reinvestment Act of 2009 (Public Law 111-5).This Small Business Innovation Research Phase II project addresses the low volume manufacturing of test probe cards through Electrochemical Printing.Integrated Circuit Board Testing Connectors(ICBTCs) include contactors that are metal structures designed to contact integrated circuit boards (ICBs) at the wafer level during production with wafer probe cards (WPCs) or after packaging with package testing sockets (PTSs). WPC contactors are manufactured with semiconductor processes (SPs) in high volume whereas PTS contactors are built in lower volume with conventional microfabrication (CM) or low cost plating through dryfilm masks on flexible substrates. There is increasing pressure to reduce the ICB package size and PTS contactor dimensions while also reducing testing costs. This project addresses these needs by developing a moderate cost, high resolution electrochemical printing technology.The broader impacts of this research include providing repair solutions for high value products that are currently thrown away and reducing plating bath inventory in an electrodeposition tool by at least 10X. The long term opportunity is for EcP is to revolutionize desktop microfabrication because it is a low cost, single step process that has promise of producing complex 3D fully functional polymer, semi-conductor, and metal parts.

该奖项是根据2009年美国复苏和再投资法案资助的（公法111-5）。该小型企业创新研究第二阶段项目通过电化学印刷解决测试探针卡的小批量制造问题。集成电路板测试连接器（ICBTC）包括接触器，该接触器是设计用于接触集成电路板（ICB）的金属结构。在使用晶圆探针卡（WPC）进行生产期间或在使用封装测试插座（PTS）进行封装之后，在晶圆级进行测试。WPC接触器采用半导体工艺（SP）大批量制造，而PTS接触器则采用传统微加工（CM）或通过柔性基板上的干膜掩模进行低成本电镀来批量制造。减小ICB封装尺寸和PTS接触器尺寸同时降低测试成本的压力越来越大。该项目通过开发一种成本适中、分辨率高的电化学印刷技术来满足这些需求。该研究的更广泛影响包括为目前被丢弃的高价值产品提供修复解决方案，并将电沉积工具中的电镀液库存减少至少10倍。 EcP的长期机会是彻底改变桌面微制造，因为它是一种低成本的单步工艺，有望生产复杂的3D全功能聚合物，半导体和金属部件。