SBIR Phase II: Manufacturing of Package Test Socket Contactors through Innovations in Electrochemical Printing

该奖项是根据2009年美国复苏和再投资法案（公法111-5）资助的。这个小企业创新研究二期项目通过电化学印刷解决了测试探针卡的小批量生产。集成电路板测试连接器（icbtc）包括接触器，它是一种金属结构，设计用于在生产过程中使用晶圆探测卡（wpc）或封装测试插座（PTSs）封装后在晶圆级接触集成电路板（icb）。WPC接触器是用半导体工艺（SPs）大批量制造的，而PTS接触器是用传统的微加工（CM）或通过柔性基板上的干膜掩膜低成本镀制而成的。在降低测试成本的同时，减小ICB封装尺寸和PTS接触器尺寸的压力越来越大。该项目通过开发一种成本适中、分辨率高的电化学印刷技术来满足这些需求。这项研究的广泛影响包括为目前被丢弃的高价值产品提供修复解决方案，并将电沉积工具中的镀液库存减少至少10倍。EcP的长期机遇在于彻底改变桌面微加工，因为它是一种低成本、单步工艺，有望生产复杂的3D全功能聚合物、半导体和金属部件。

This award is funded under the American Recovery and Reinvestment Act of 2009 (Public Law 111-5).This Small Business Innovation Research Phase II project addresses the low volume manufacturing of test probe cards through Electrochemical Printing.Integrated Circuit Board Testing Connectors(ICBTCs) include contactors that are metal structures designed to contact integrated circuit boards (ICBs) at the wafer level during production with wafer probe cards (WPCs) or after packaging with package testing sockets (PTSs). WPC contactors are manufactured with semiconductor processes (SPs) in high volume whereas PTS contactors are built in lower volume with conventional microfabrication (CM) or low cost plating through dryfilm masks on flexible substrates. There is increasing pressure to reduce the ICB package size and PTS contactor dimensions while also reducing testing costs. This project addresses these needs by developing a moderate cost, high resolution electrochemical printing technology.The broader impacts of this research include providing repair solutions for high value products that are currently thrown away and reducing plating bath inventory in an electrodeposition tool by at least 10X. The long term opportunity is for EcP is to revolutionize desktop microfabrication because it is a low cost, single step process that has promise of producing complex 3D fully functional polymer, semi-conductor, and metal parts.