BRIGE: Processing of Metallic Thin Films via Magnetron Sputtering

该研究项目的目标是建立一种最先进的磁控溅射能力，以找到将内部腔条件(例如，离子通量)与外部参数变化(例如，功率、气体压力)联系起来的单一统一指示器参数。直流磁控溅射是一种物理气相沉积(PVD)技术，它允许覆盖元素周期表中的几乎所有元素。尽管溅射是一种常用的工业技术，但目前的做法大多依赖于试验和错误方法，这大大限制了其更广泛的使用。通过设备和实验的组合设计，我们将增强溅射沉积系统的一般知识，这将导致多层膜和纳米薄膜等材料的加工。这项研究的结果将使高度工程化的微结构的加工成为可能，这些微结构可用于材料科学、纳米技术和可再生能源领域的创新应用。这些贡献将使这种PVD技术成为放大具有增强性能(例如，电气、机械)的材料的有力竞争者。

The objective of this research project is to establish a state-of-the-art magnetron sputtering capability to find a single unifying indicator parameter relating internal chamber conditions (e.g., ion flux) to external parameter changes (e.g., power, gas pressure). Direct current magnetron sputtering is a physical vapor deposition (PVD) technique which allows for the coating of almost all elements in the periodic table. Even though sputtering is a commonly used industrial technique, current practices rely mostly on trial and error approaches which significantly limit its broader use. By using a combinatorial design of equipment and experiments, we will enhance the general knowledge in sputtering deposition systems, which will lead to the processing of materials such as multilayers and nano-grained films.The results of this research will allow for the processing of highly engineered microstructures which can be used for innovative applications in the fields of materials science, nanotechnology and renewable energy. Such contributions will make this PVD technique a serious contender foruse in the scaling up of materials with enhanced properties (e.g. electrical, mechanical).