19th Annual Workshop on Interconnections within High Speed Digital Systems. To be Held May 18-21, 2008 in Santa Fe, NM.

智力优势：第 19 届 IEEE/LEOS 高速数字系统互连研讨会的目的是研究新兴和未来计算机和通信系统的互连要求；并传播有关组件、封装和系统级别最先进的光学和电气互连技术的信息。本次研讨会由来自行业从业者和大学研究人员的 16 场特邀报告以及 3 场全体会议组成，由电气和光子互连领域的专家参加。此外，与会者分成较小的小组，就共同的技术问题进行协作，以阐明系统性能和成本的权衡。 更广泛的影响：研讨会的跨学科和互动形式为初级研究人员参与者提供了巨大的教育益处，培训他们提供下一代高性能互连解决方案并学会在团队环境中进行创造性思考。在研讨会问题的讨论过程中，初级研究人员和该领域的专家密切合作；鼓励初级研究人员通过研讨会上的（同行评审的）海报会议展示他们的工作。鼓励初级研究人员的参与也有助于为研讨会带来地理和技术方面的多样性。

Intellectual Merit: The purpose of the 19th Annual IEEE/LEOS Workshop on Interconnections within High-Speed Digital Systems is to examine the interconnection requirements of emerging and future computer and communications systems; and to disseminate information about state-of-the art optical and electrical interconnectiontechnologies at the component, packaging, and systems level. The workshop consists of 16 invited talks from industry practioners and university researchers plus three plenary talks, and is attended by experts in electrical and photonic interconnects. In addition, the attendees break into smaller groups to collaborate on a common technology problem, selected to elucidate system performance and cost tradeoffs. Broader Impacts: The interdisciplinary and interactiveformat of the Workshop offers a great educational benefit to junior researcher participants, training them to provide the next generation of high performance interconnection solutions and to learn to think creatively in a team environment. During discussions of the workshop problem, junior researchers and experts in the field collaborate very closely; and junior researchers are encouraged to show their work through a (peer-reviewed) poster session at the workshop. Encouraging participation from junior researchers also helps to bring diversity, both geographic as well as technical, to the workshop.