The Fundamental Study of UV Bonding Abrasive Tools with Application to the Semiconductor Industry

该奖项的研究目标是加深对UV(紫外线)结合的了解，以便开发比现有磨具更高效、更环保的新磨具。本研究将从力学和紫外光能量转换两个方面研究紫外光固化过程中磨料、填料和紫外光固化树脂之间的相互作用。为了满足磨具的特殊要求，还将对复合材料的性能进行改性和增强。具体地说，这项研究将(A)开发一种优化的树脂作为紫外光固化粘结剂的基础，(B)开发紫外光能量转换模型以分析对树脂的紫外线能量吸收，(C)开发和优化包括树脂、磨料和其他填料的复合材料的模型，以分析和预测磨料工具的特性，以及(D)通过磨料实验验证和修改所得到的模型。将设计和组装两种独特的线锯紫外光键合设备和切屑刀片紫外光键合设备。该模型将通过使用这两种装置获得的实验结果进行验证。该项目的成功将彻底改变半导体行业磨具的制造。该项目将提高线锯、切割和研磨的性能和成本效益，这些都是半导体行业中非常重要的工艺。这些应用还可以扩展到不同的精密工程应用。社会影响倡议包括针对俄亥俄州西北部地区的语法和高中生以及教师的暑期研究活动。该项目将为大托莱多地区代表性不足的社区创造特殊机会。此外，托莱多大学和位于中国的浙江工业大学还将在教育和研究方面开展新的合作活动。

The research objective of this award is to generate a greater understanding of UV (ultraviolet) bonding in order to develop new abrasive tools that are more efficient and environmentally friendly than current abrasive tools. This research will investigate the interaction between abrasive, filler and UV-curable resin during the UV curing process on both mechanics and UV light energy translation. In order to meet the special needs of abrasive tools, modification and reinforcement of the composite characteristics will also be investigated. Specifically this research will (a) develop an optimized resin as the base of a UV-curable bonding agent, (b) develop a UV light energy translation model to analyze UV energy absorbing to the resin, (c) develop and optimize a model of the composite including resin, abrasive and other fillers, to analyze and predict the characteristics of the abrasive tools, and (d) validate and modify the resulting models with abrasive processes experiments. Two unique apparatuses for UV bonding of wire saw and for UV bonding of dicing blades will be designed and assembled. The model will be validated using experimental results obtaining using these two apparatus.The success of this project will revolutionize the fabrication of abrasive tools for the semiconductor industry. The project will enhance the performance and cost effectiveness of wire saw, dicing and lapping, which are very important processes in semiconductor industry. These applications can also be extended to different precision engineering applications. Societal impact initiatives include summer research activities for grammar and high school students and teachers in Northwest region of Ohio. The project will create special opportunities for underrepresented communities in greater Toledo area. Also, new collaboration activities in education and research will be created between The University of Toledo and The Zhejiang University of Technology in China.