The Fundamental Study of UV Bonding Abrasive Tools with Application to the Semiconductor Industry

紫外粘合磨具的基础研究及其在半导体行业的应用

• 批准号: 0855769
• 负责人: Ioan Marinescu
• 金额: $ 39.92万
• 依托单位: University of Toledo
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2009
• 资助国家: 美国
• 起止时间: 2009-06-01 至 2013-05-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0855769&HistoricalAwards=false
• 关键词: Fundamental; Study; UV; Bonding; Abrasive

The research objective of this award is to generate a greater understanding of UV (ultraviolet) bonding in order to develop new abrasive tools that are more efficient and environmentally friendly than current abrasive tools. This research will investigate the interaction between abrasive, filler and UV-curable resin during the UV curing process on both mechanics and UV light energy translation. In order to meet the special needs of abrasive tools, modification and reinforcement of the composite characteristics will also be investigated. Specifically this research will (a) develop an optimized resin as the base of a UV-curable bonding agent, (b) develop a UV light energy translation model to analyze UV energy absorbing to the resin, (c) develop and optimize a model of the composite including resin, abrasive and other fillers, to analyze and predict the characteristics of the abrasive tools, and (d) validate and modify the resulting models with abrasive processes experiments. Two unique apparatuses for UV bonding of wire saw and for UV bonding of dicing blades will be designed and assembled. The model will be validated using experimental results obtaining using these two apparatus.The success of this project will revolutionize the fabrication of abrasive tools for the semiconductor industry. The project will enhance the performance and cost effectiveness of wire saw, dicing and lapping, which are very important processes in semiconductor industry. These applications can also be extended to different precision engineering applications. Societal impact initiatives include summer research activities for grammar and high school students and teachers in Northwest region of Ohio. The project will create special opportunities for underrepresented communities in greater Toledo area. Also, new collaboration activities in education and research will be created between The University of Toledo and The Zhejiang University of Technology in China.

该奖项的研究目标是更好地了解UV（紫外线）粘合，以开发比现有磨具更高效、更环保的新型磨具。本研究将探讨研磨剂、填充剂与光固化树脂在光固化过程中的相互作用，包括光固化过程中的力学行为与光能量传递。 为了满足磨具的特殊需要，还将研究复合材料特性的改性和增强。 具体而言，本研究将（a）开发一种优化的树脂作为紫外光固化粘结剂的基础，（B）开发一种紫外光能量转换模型来分析树脂对紫外光能量的吸收，（c）开发和优化一种包括树脂、磨料和其他填料的复合材料模型，以分析和预测磨具的特性，以及（d）通过研磨工艺实验验证和修改所得到的模型。 两个独特的设备UV键合的线锯和UV键合的切割刀片将被设计和组装。 该模型将通过使用这两种设备获得的实验结果进行验证。该项目的成功将彻底改变半导体行业研磨工具的制造。该项目将提高半导体工业中非常重要的线锯、切割和研磨工艺的性能和成本效益。这些应用也可以扩展到不同的精密工程应用。社会影响倡议包括为俄亥俄州西北地区的语法和高中学生和教师举办的夏季研究活动。该项目将为大托莱多地区代表性不足的社区创造特殊机会。此外，托莱多大学和中国浙江工业大学将在教育和研究方面开展新的合作活动。