SBIR Phase I: Nanocomposites for Electronic Packaging

点击翻译按钮获取中文摘要

This Small Business Innovation Research Phase I project will explore the feasibility of using well dispersed nanocrystals with high thermal conductivity as functional fillers to improve the thermal and mechanical properties of electronic packaging materials without sacrificing processibility. The successful development of nanocomposites will ensure that advanced packaging technology is capable of facing the challenges from the future generations of chips and circuits. The main competitors for these nanocomposites will be traditional filler reinforced composites, and carbon nanotube reinforced composites. The success of this SBIR project will also advance the state of the art in the synthesis of wide band bap semiconductor materials. These materials have unique mechanical, optical and electrical properties, which will be applied in many different areas, such as lithography, photodetectors, and light emitting diodes.This award is funded under the American Recovery and Reinvestment Act of 2009 (Public Law 111-5).