STTR Phase II: Nanoscale Silver Pastes for Low-Temperature Joining of Power Semiconductor Devices

STTR 第二阶段：用于功率半导体器件低温连接的纳米级银浆

• 批准号: 0923894
• 负责人: Susan Luo
• 金额: $ 50万
• 依托单位: NBE Technologies, LLC
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2009
• 资助国家: 美国
• 起止时间: 2009-08-01 至 2011-07-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0923894&HistoricalAwards=false
• 关键词: STTR; Phase; II; Nanoscale; Silver

This award is funded under the American Recovery and Reinvestment Act of 2009 (Public Law 111-5).This Small Business Technology Transfer (STTR) Phase II project aims to accelerate the commercialization of an enabling nanomaterial for joining semiconductor chips. The unique features of this innovative material would reduce the manufacturing cost for making lead-free electronics that are required to work in harsh environments and to possess significantly improved performance and reliability over the state-of-the-art technologies. This project focuses on obtaining and sharing extensive scientific knowledge that will lower the risk and barrier for electronic manufacturers worldwide to rapidly implement this nanomaterial in mass production.The broader impacts of a successful project will be to electronics manufacturers in the United States. The U.S. has fallen behind their European and Asian competitors in the move to lead-free products. This enabling nanomaterial will reduce manufacturing complexity and cost, and will help U.S. manufacturers in capturing a significant share of nearly $500 million-dollar market for chip-attach materials.

该奖项是根据2009年美国复苏和再投资法案（公法111-5）资助的。该小企业技术转让（STTR）第二阶段项目旨在加速用于连接半导体芯片的纳米材料的商业化。 这种创新材料的独特功能将降低制造无铅电子产品的制造成本，这些电子产品需要在恶劣环境中工作，并具有比最先进技术显着提高的性能和可靠性。 该项目的重点是获得和分享广泛的科学知识，这将降低全球电子制造商在大规模生产中快速实施这种纳米材料的风险和障碍。一个成功的项目将对美国的电子制造商产生更广泛的影响。美国在无铅产品方面已经落后于欧洲和亚洲的竞争对手。这种使能纳米材料将降低制造复杂性和成本，并将帮助美国制造商在近5亿美元的芯片附着材料市场中占据重要份额。