SBIR Phase I: Novel Glass/Glass-Ceramic Material for Electronics Packaging

该小型企业创新研究（SBIR）第一阶段项目旨在解决电子封装限制，这是商业和国防电子进一步发展的系统成本和性能的限制因素。 满足这些市场需求的传统封装方法，包括FR 4、液晶聚合物和低温共烧陶瓷，都遇到了基本的材料限制。 市场需求正在推动更小的封装体积、更高密度的互连、封装内热管理以及最终的光波导能力。 该提案将研究使用创新的玻璃陶瓷材料作为这些电子应用的封装解决方案的可行性。 这种材料使用第一代半导体设备以简单的三步工艺进行加工，产品可以形成玻璃，陶瓷或玻璃和陶瓷的区域。 第一阶段的研究将侧重于三项任务。 首先，证明该材料可用于高压微流体（1500 psi），以增强热管理。 其次，将制造玻璃陶瓷，以展示不同间距的10µm、50µm、100µm高密度铜互连。第三，通过确定生产光波导的最大角度和最小弧长来研究材料用作波导介质的能力。该项目的更广泛影响/商业潜力是针对与最先进的电子封装相关的技术限制和成本约束。 这些限制已经获得了新的认识和重要性的制造商。 在过去的十年中，封装被认为是集成电路发展之后的第二个问题，但不断增加的成本和衬底材料的限制使其成为最重要的问题。这一提议将直接解决这些成本和材料限制。目前，传统电子封装市场每年超过60亿美元，但不仅面临性能问题，还面临环境挑战。 欧盟作为其减少有害物质指令的一部分，强调了含卤素材料的风险，例如用于电子包装的FR 4。这种玻璃陶瓷材料不含卤素元素，可回收利用。 虽然一级市场潜力巨大，但这种材料在光电子、MEMS、医疗、纳米技术和生物应用方面也有诱人的二级市场。

This Small Business Innovation Research (SBIR) Phase I project proposes to address electronics packaging constraints, the limiting element in system cost and performance for further advancements in commercial and defense electronics. Traditional packaging approaches to address the needs in these markets, including FR4, liquid crystal polymers, and Low Temperature Co-Fired Ceramics, are running into fundamental material limits. Market needs are pushing for smaller package volumes, higher density interconnects, in-package thermal management and ultimately optical waveguide capability. This proposal will investigate the feasibility of using an innovative glass ceramic material as a packaging solution for these electronics applications. This material is processed using first generation semiconductor equipment in a simple three- step process and the product can be formed into glass, ceramic, or regions of both glass and ceramic. This Phase I study will focus on three tasks. First, demonstrate the material can be used for high-pressure microfluidics (1500 psi) for enhanced thermal management. Second, the glass ceramic will be fabricated to demonstrate 10µm, 50µm, 100µm high density copper interconnects at various pitches. Third, investigate the material's ability to be used as a waveguide medium by determining the maximum angle and minimum arc-length to produce an optical waveguide.The broader impact/commercial potential of this project is to target the technical limitations and cost constraints associated with state-of-the-art electronics packaging. These constraints have garnered new recognition and importance to manufacturers. Over the last decade, packaging was considered a second-order issue after integrated circuit development, but increasing costs and substrate material limitations have brought it to the forefront. This proposal will directly address these cost and material constraints. The current market for traditional electronics packaging exceeds $6B a year, but is facing not only performance, but environmental challenges. The European Union, as part of their Reduction of Hazardous Substances directive, has highlighted the risks of halogen containing material, such as FR4 that is used in electronics packaging. This glass ceramic material contains zero halogenic elements and can be recycled. While the primary market potential is significant, there are intriguing secondary markets for this material in optoelectronics, MEMS, medical, nanotechnology, and biological applications.