BRIGE: Research and Education on Mechanical Behavior of Wafer-Level Films in Integrated Systems

这项扩大参与工程研究启动基金（bridge）资助用于研究微系统中回流过程中薄膜破裂的基本力学问题。微电子和纳米电子系统的三维集成要求晶圆级制造工艺的创新。晶圆级薄膜层合技术的发展对于进一步实现功能集成和降低功耗至关重要。将建立一种多物理场方法，包括新的理论发展和数值实现，来研究集成系统中晶圆级薄膜的力学行为。多尺度分析将分别在纳米、微观和宏观尺度上理解破坏过程。实验将生成原位水分增重、水分敏感性和回流的数据。专门设计的小型组件将被制造和测试。试验数据将用于验证理论预测和数值模拟结果。如果成功，本研究结果将通过提供最佳的制造加工窗口，直接有利于三维微纳电子封装和系统集成的技术发展。该研究成果将通过提供最佳设计方案来帮助设计新的晶圆级薄膜材料。从这个调查中获得的知识将避免“试错”实验，并且将有助于使新的过程开发和系统级集成成为现实。这项研究将通过成果的传播使学术界、半导体行业和公众受益。将整合一项教育计划，以扩大工程研究人员的参与，包括来自代表性不足的群体和残疾人士在工程学科中的参与。该教育计划还包括促进少数族裔本科生的科学、技术、工程和数学（STEM）职业发展的外展项目，并将激发K-12学生对工程的兴趣，并促进他们未来的职业选择。

This Broadening Participation Research Initiation Grants in Engineering (BRIGE) grant provides funding to investigate the fundamental mechanics issues associated with thin film rupture at reflow process in microsystems. The three-dimensional integration of micro- and nano- electronics systems require innovations of manufacturing processes at the wafer level. The development of wafer-level thin film lamination is critical for the success in further function integration and lower power consumption. A multi-physics approach, which includes new theory development and numerical implementation, will be established to investigate the mechanical behavior of wafer-level films in integrated systems. Multi-scale analysis will be developed to understand the failure processes at the nano-, micro-, and macro-scales, respectively. Experiments will generate data for in-situ moisture weight gain, moisture sensitivity, and reflow. Specially designed small-scale assemblies will be fabricated and tested. The test data will be used to validate the theoretical predictions and numerical simulation results. If successful, the results of this research will directly benefit the technology development of three-dimensional micro- and nano- electronics packaging and system integration by providing an optimal manufacturing processing window. The research outcome will assist in the design of new wafer-level film materials by providing an optimal design protocol. Knowledge gained from this investigation will avoid "trial-and-error" experiments, and will contribute to making new process development and system-level integration a reality. This research will benefit the academic community, semiconductor industry, and general public through the dissemination of results. An education plan will be integrated to broaden the participation of engineering researchers including members from underrepresented groups and persons with disabilities in the engineering disciplines. The education plan also includes outreach programs that will promote science, technology, engineering and mathematics (STEM) careers of minority undergraduate students, and will stimulate interest and promote future career choices in engineering for K-12 students.