SBIR Phase I: Organic/Inorganic Hybrid Circuits on Film using Photolithography

SBIR 第一阶段：使用光刻技术在薄膜上制作有机/无机混合电路

• 批准号: 1047030
• 负责人: John DeFranco
• 金额: $ 14.99万
• 依托单位: Orthogonal, Inc
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2011
• 资助国家: 美国
• 起止时间: 2011-01-01 至 2011-12-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1047030&HistoricalAwards=false
• 关键词: SBIR; Phase; Organic; Inorganic; Hybrid

This Small Business Innovation Research (SBIR) Phase I project aims to demonstrate the integration of hybrid materials (both organic and inorganic) onto a flexible substrate using a photolithographic process made possible by the proprietary fluorinated resist chemistry of Orthogonal. First, the challenges of performing photolithography on flexible substrates will be addressed by using new resist materials, and investigating both a lamination process that would place the flexible materials onto a rigid substrate and a roll-to-roll process. At the same time, device parameters will be explored on rigid substrates in order to design and optimize high-performance circuits based on hybrid electronic structures. Finally, the optimized devices will be made on flexible substrates using the best methodology determined.The broader/commercial impact of this project will be the potential to enable the large-scale manufacturing of organic flexible electronic devices by leveraging the existing infrastructure used in the display industry. The complementary circuits based on oxide as well as organic semiconductors will allow for high-performance and low-power circuit designs on plastic for Radio Frequency Identification (RFID) and sensor applications.

这个小企业创新研究（SBIR）第一阶段项目旨在展示混合材料（有机和无机）集成到一个灵活的基板上，使用一个由Orthogonal专有的氟化抗蚀剂化学实现的光刻工艺。首先，将通过使用新的抗蚀剂材料来解决在柔性基板上执行光刻的挑战，并调查将柔性材料放置到刚性基板上的层压工艺和卷对卷工艺。 同时，将在刚性衬底上探索器件参数，以设计和优化基于混合电子结构的高性能电路。最后，将使用确定的最佳方法在柔性基板上制造优化的器件。该项目的更广泛/商业影响将是通过利用显示器行业中使用的现有基础设施来实现有机柔性电子器件的大规模制造的潜力。 基于氧化物和有机半导体的互补电路将允许在塑料上进行高性能和低功耗的电路设计，用于射频识别（RFID）和传感器应用。