Millimeter-Wave Integrated Circuits for Ultra High-Speed Wireless Board-to-Board Computer Communication (A01)

用于超高速无线板对板计算机通信的毫米波集成电路（A01）

• 批准号: 201423323
• 金额: --
• 依托单位: Professur für Schaltungstechnik und Netzwerktheorie
• 依托单位国家: 德国
• 项目类别: Collaborative Research Centres
• 财政年份: 2011
• 资助国家: 德国
• 起止时间: 2010-12-31 至 2019-12-31
• 项目状态: 已结题
• 来源: https://gepris.dfg.de/gepris/projekt/201423323?language=en
• 关键词: Millimeter; Wave; Integrated; Circuits; Ultra

The goal of project A01 is to study and realize Silicon mm-wave integrated circuits required for the wireless links of the HAEC Box, capable of 100 Gbit/s over a carrier of 180 GHz, with particular focus on the minimization of the energy required per transferred bit. This will be studied for the receiver frontend and the analog-to-digital converter (ADC) modules with focus on the adaptivity and tunability of circuits and systems to deliver optimal efficiency also at lower data rates than the maximum. In the mm-wave frontend, circuit blocks will be developed to operate in fast-wake-up mode. The power consumption of the ADC will be automatically minimized controlling the sampling rate with a delay-locked loop.

A01项目的目标是研究和实现HAEC盒无线链路所需的硅毫米波集成电路，在180 GHz的载波上能够达到100 Gbit/s的速度，特别关注每个传输比特所需的能量最小化。这将在接收器前端和模数转换器（ADC）模块中进行研究，重点关注电路和系统的自适应和可调性，以在低于最大数据速率的情况下提供最佳效率。在毫米波前端，电路模块将开发为在快速唤醒模式下工作。ADC的功耗将自动最小化，通过延迟锁定环路控制采样率。