SBIR Phase I: Microwave Heating of Reaction-Bonded Silicon Carbide Ceramics

SBIR 第一阶段：反应烧结碳化硅陶瓷的微波加热

• 批准号: 1113635
• 负责人: Shawn Allan
• 金额: $ 15万
• 依托单位: Ceralink Inc.
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2011
• 资助国家: 美国
• 起止时间: 2011-07-01 至 2012-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1113635&HistoricalAwards=false
• 关键词: SBIR; Phase; Microwave; Heating; Reaction

This Small Business Innovation Research Phase I project addresses the need for lower cost ceramic materials, specifically for reaction-bonded silicon carbide (RBSC) products. RBSC is used in a multitude of applications ranging from kiln furniture to body armor inserts to ultra-high purity semiconductor components. Lowering costs would make ceramic materials available for more wide-spread use. Currently, these products are limited in applications due to the high costs associated with expensive raw materials and high-temperature processing requirements. This project addresses these issues though the use of low cost preform materials and an innovative thermal processing technique. In prior work, a new method for producing RBSC was developed, through liquid infiltration of molten silicon by direct microwave heating. This innovative process allows for complete infiltration of porous preforms using microwaves, without the need for a high vacuum environment. However, one of the persistent technical issues is the formation of undesirable silicon veins in the RBSC. This may be caused by in part by a significant exothermic reaction during the infiltration. The veins can detrimentally affect the physical properties of the final RBSC. The anticipated technical results of this work are to identify the origin of silicon vein formation, and to develop methods to mitigate this issue. The broader impact/commercial potential of this project is to lower the cost of RBSC ceramics, making them more economically viable in current applications, and increasing their use in previously unfeasible applications where RBSC could provide superior performance characteristics. The successful development of low-cost, higher strength, and higher purity RSBC would provide significant benefits to ceramic component manufacturers and end users. Some of the current applications for RBSC include kiln furniture and various burner parts for combustion. Areas targeted for expanded use are: wear resistant components (e.g., slip ring seals), body armor for soldiers, sand blasting nozzles, and diffusion components for the semiconductor industry. The semiconductor industry is of particular interest. As devices continue to get smaller, the purity of diffusion components is becoming a critical issue. The use of this RBSC for high-purity wafer carriers would be advantageous, as preforms in the green state can be heated and purified. Finally, this work will enhance scientific and technological understanding of high temperature exothermic reactions, explore methods to control exothermic rates of reaction, and quantify the energy benefit of microwave processing versus conventional methods.

该小型企业创新研究第一阶段项目解决了对低成本陶瓷材料的需求，特别是反应烧结碳化硅（RBSC）产品。RBSC用于从窑具到防弹衣插入件到超高纯度半导体元件的多种应用。降低成本将使陶瓷材料得到更广泛的应用。目前，由于与昂贵的原材料和高温加工要求相关的高成本，这些产品在应用中受到限制。该项目通过使用低成本的预制件材料和创新的热处理技术来解决这些问题。在以前的工作中，开发了一种新的方法来生产RBSC，通过直接微波加热熔融硅的液体渗透。这种创新工艺允许使用微波完全渗透多孔预制件，而不需要高真空环境。 然而，持续存在的技术问题之一是在RBSC中形成不期望的硅脉。 这可能部分地由渗透期间的显著放热反应引起。静脉可以在心理上影响最终RBSC的物理性质。 这项工作的预期技术成果是确定硅脉形成的起源，并开发减轻这一问题的方法。该项目更广泛的影响/商业潜力是降低RBSC陶瓷的成本，使其在当前应用中更具经济可行性，并增加其在以前不可行的应用中的使用，其中RBSC可以提供上级性能特性。低成本、高强度和高纯度RSBC的成功开发将为陶瓷部件制造商和最终用户带来巨大利益。 RBSC目前的一些应用包括窑具和各种燃烧器部件。扩大使用的目标领域是：耐磨部件（例如，滑环密封件）、士兵的防弹衣、喷砂喷嘴和半导体工业的扩散元件。 半导体行业尤其令人感兴趣。随着器件不断变小，扩散组件的纯度正成为一个关键问题。将该RBSC用于高纯度晶片载体将是有利的，因为处于绿色状态的预成型件可以被加热和纯化。最后，这项工作将提高科学和技术的高温放热反应的理解，探索控制反应放热速率的方法，并量化微波处理与传统方法相比的能源效益。