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22nd Annual Workshop on Interconnections within High-speed Digital Systems: Support for Student Participation, May 8-11, 2011 Santa Fe, NM.

22nd Annual Workshop on Interconnections within High-speed Digital Systems: Support for Student Participation, May 8-11, 2011 Santa Fe, NM.
第 22 届高速数字系统互连年度研讨会:支持学生参与,2011 年 5 月 8 日至 11 日,新墨西哥州圣达菲。
批准号:
1130322
负责人:
Zhaoran Rena Huang
金额:
$0.5万
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2011
资助国家:
美国
项目状态:
已结题
起止时间:
2011-04-15 至 2011-06-30

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英文摘要
The objective of this activity is to provide support for five students from U.S. universities to attend the 22nd Annual IEEE/LEOS Workshop on Interconnections within High-Speed Digital Systems and participate in the academic poster session. The workshop will be held May 8 - May 11, 2011 at the Eldorado Hotel & Spa in Santa Fe, New Mexico. The workshop agenda includes tutorials, invited talks, interactive problem solving sessions, and an academic poster session.Intellectual Merit: The exponential growth in data traffic and ever increasing demand for high bit-rate communications and e-services has accelerated research and development in the area of interconnection technology. The paradigm shift in computing towards parallel multicore processing requires an integrated design approach to address interconnect bottlenecks from chip-scale to system-scale architectures in networking, communications, and high performance computing. This workshop addresses the multi-disciplinary nature of these interconnection challenges by bringing together key researchers and industry experts from a variety of fields, including semiconductor devices, computing architectures and algorithms, 3D packaging, and opto-electronic integration. An academic poster session includes contributions from a selected number of high quality student papers.Broader Impacts: This workshop will have significant impact on high-speed interconnection technology discussing novel approaches to break bandwidth bottlenecks in computing networks and communication systems. Junior researchers from the U.S., including graduate students and post-docs, will benefit from the interdisciplinary and interactive workshop format, training them to provide the next generation of high performance interconnection solutions. The workshop includes a strong outreach component through interactions with academic organizations and minority-serving institutions.
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3D Integrated 80Gb/s SiGe Heterojunction Bipolar Electroabsoprtion Modulator
  • 批准号:
    1128540
  • 项目类别:
    Continuing Grant
  • 资助金额:
    $21.45万
  • 财政年份:
    2011
  • 负责人:
    Zhaoran Rena Huang
  • 依托单位:
Collaborative: 3D Integrated Imaging Receivers for 10-Gb/s Free Space Optical MIMO
  • 批准号:
    0824068
  • 项目类别:
    Standard Grant
  • 资助金额:
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  • 财政年份:
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  • 负责人:
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  • 依托单位:
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