SBIR Phase I: Scale-up Flexible Radio Frequency Electronics via Roll-to-Roll Nanomembrane Printing

SBIR 第一阶段：通过卷对卷纳米膜印刷放大柔性射频电子产品

• 批准号: 1142806
• 负责人: Hongjun Yang
• 金额: $ 15万
• 依托单位: Semerane, Inc.
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2012
• 资助国家: 美国
• 起止时间: 2012-01-01 至 2012-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1142806&HistoricalAwards=false
• 关键词: SBIR; Phase; Scale; up; Flexible

This Small Business Innovation Research (SBIR) Phase I project aims to develop cost-effective high-performance flexible radio frequency (RF) electronics based on a crystalline nanomembrane roll-to-roll printing process. Such flexible electronic systems can concurrently demonstrate high speed (5 GHz), high reliability and high conformability/flexibility, with much simplified, high-yield, and low-cost material integration and assembly processes. Continuous roll-to-roll printing processes, which are commonly used for polymer and amorphous silicon based flexible electronics manufacturing, will be developed for crystalline semiconductors, which are typically batch processed on rigid substrates for high-performance miniaturized electronics. The broader/commercial impact of this project will be the potential to offer cost-effective, high-speed flexible/conformal electronics and integrated circuits at RF frequency, which are highly desirable for a wide range of market applications, including phased array antennas, conformal communication/surveillance systems, wearable electronics, high-performance flexible sensors, and high resolution/low power consumption flexible imaging/display systems. This technology is expected to bridge the gap between high-performance rigid electronics and low-cost flexible electronics, offering a unique product for high-speed flexible RF electronics. The roll-to-roll printing process will also enable scale-up production and manufacturing of crystalline semiconductor nanomembranes for cost-effective flexible RF electronics and photonics.

这个小企业创新研究（SBIR）第一阶段项目旨在开发基于晶体纳米膜卷对卷印刷工艺的具有成本效益的高性能灵活射频（RF）电子产品。 这样的柔性电子系统可以同时表现出高速（5GHz）、高可靠性和高一致性/柔性，具有非常简化的、高产量和低成本的材料集成和组装工艺。通常用于聚合物和非晶硅基柔性电子制造的连续卷对卷印刷工艺将被开发用于晶体半导体，晶体半导体通常在刚性基板上批量加工，用于高性能小型化电子产品。该项目的更广泛/商业影响将是在RF频率下提供具有成本效益的高速柔性/共形电子器件和集成电路的潜力，这对于广泛的市场应用是非常理想的，包括相控阵天线，共形通信/监视系统，可穿戴电子器件，高性能柔性传感器和高分辨率/低功耗柔性成像/显示系统。该技术有望弥合高性能刚性电子器件和低成本柔性电子器件之间的差距，为高速柔性RF电子器件提供独特的产品。卷对卷印刷工艺还将使晶体半导体纳米膜的规模化生产和制造成为可能，用于具有成本效益的柔性RF电子和光子学。