SBIR Phase I: RF MEMS Relay for ATE Applications

SBIR 第一阶段：用于 ATE 应用的 RF MEMS 继电器

• 批准号: 1143347
• 负责人: Chopin Hua
• 金额: $ 14.99万
• 依托单位: Laserlith Corporation
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2012
• 资助国家: 美国
• 起止时间: 2012-01-01 至 2012-12-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1143347&HistoricalAwards=false
• 关键词: SBIR; Phase; RF; MEMS; Relay

This Small Business Innovation Research (SBIR) Phase I project will develop RF MEMS (Radio Frequency Microelectromechanical Systems) relays for automated test equipment (ATE), wireless frontends, and other commercial applications. As the advancement of microchip technology continues, the testing and qualification of microchips become more challenging and costly. RF MEMS may enable lower cost, higher throughput and more repeatable test and qualification in mainstream semiconductor manufacturing. In particular, RF MEMS relays may offer benefits for probing of next generation 3D chips with thru-wafer vias that require sensitive and yet very rapid test capabilities. The proposed project addresses the manufacturability and packaging challenges for production. In comparison to boutique manufacturing processes utilized by many RF MEMS technologies, the proposed project leverages the proven and robust silicon MEMS production processes and infrastructure. Furthermore, packaging is performed using wafer-level hermetic packaging that addresses the high cost of hermetic sealing for RF MEMS devices. ATE applications represent the initial application of the proposed RF MEMS relay technology. Wireless applications, as well as other applications, can be enabled by lower prices as production volumes are ramped up. Anticipated results include a RF MEMS relay technology, with low-cost integrated packaging, ready and qualified for production.The broader impact/commercial potential of this project includes ATE, wireless, and enabling RF capabilities for the scientific community. RF MEMS may offer ATE key advantages in testing next generation microchips, including improved repeatability and reliability compared to conventional mechanical relays. RF MEMS may be critical for testing next generation 3D microchips with thru-wafer-vias that require sensitive and yet high-throughput testing. For wireless, RF MEMS address reconfiguration and tuning for improved power efficiency and link robustness of radios. For example, RF MEMS may be utilized for (1) changing a reconfigurable antenna from a high bandwidth line-of-sight configuration to a lower bandwidth diversity configuration, or (2) compensating a wireless handset?s power amplifier for its changing operating environment to maintain maximum efficiency (including impedance and distance from the base station). For scientific applications, RF MEMS relays offer low insertion loss and superior linearity from DC to 100 GHz. In comparison to semiconductor transistors, RF MEMS have an approximate 10x reduction in insertion loss. Thus, a variety of radio architectures may benefit, as well as radiometers for monitoring weather and climate. Anticipated results include a RF MEMS technology, with low cost integrated packaging, ready and qualified for production.

该小型企业创新研究(SBIR)第一阶段项目将开发用于自动测试设备(ATE)、无线前端和其他商业应用的RF MEMS(射频微电子机械系统)继电器。随着微芯片技术的不断进步，微芯片的测试和鉴定变得更加具有挑战性和成本。射频MEMS可以在主流半导体制造中实现更低的成本、更高的产量和更可重复的测试和鉴定。特别是，RFMEMS继电器可以为探测具有直通晶片通孔的下一代3D芯片提供好处，这些芯片需要灵敏而又非常快速的测试能力。拟议的项目解决了生产的可制造性和包装方面的挑战。与许多RFMEMS技术使用的精品制造工艺相比，建议的项目利用了成熟和强大的硅MEMS生产工艺和基础设施。此外，封装采用晶圆级密封封装，解决了RFMEMS器件的高密封成本问题。ATE的应用代表了所提出的RFMEMS继电器技术的初步应用。随着生产量的增加，无线应用和其他应用可以通过更低的价格实现。预期成果包括具有低成本集成封装的RF MEMS继电器技术，可用于生产。该项目的更广泛影响/商业潜力包括为科学界提供ATE、无线和使能射频功能。与传统的机械继电器相比，RFMEMS在测试下一代微芯片方面可以提供ATE的关键优势，包括提高重复性和可靠性。RFMEMS对于测试具有通孔的下一代3D微芯片可能是至关重要的，这些通孔需要敏感且高通量的测试。对于无线，RF MEMS地址重新配置和调谐，以提高无线电的功率效率和链路稳健性。例如，RFMEMS可用于(1)将可重构天线从高带宽视线配置改变为低带宽分集配置，或(2)补偿无线手持设备S功率放大器不断变化的工作环境以保持最大效率(包括阻抗和与基站的距离)。对于科学应用，RF MEMS继电器在DC至100 GHz范围内具有低插入损耗和卓越的线性度。与半导体晶体管相比，RFMEMS的插入损耗降低了约10倍。因此，各种无线电架构以及用于监测天气和气候的辐射计可能会受益。预期的结果包括射频MEMS技术，具有低成本的集成封装，准备好并符合生产条件。