SBIR Phase I: RF MEMS Relay for ATE Applications

该小型企业创新研究（SBIR）第一阶段项目将开发用于自动测试设备（ATE），无线前端和其他商业应用的RF MEMS（射频微机电系统）继电器。 随着微芯片技术的不断进步，微芯片的测试和鉴定变得更具挑战性和成本更高。 RF MEMS可以在主流半导体制造中实现更低的成本、更高的吞吐量和更可重复的测试和鉴定。 特别是，RF MEMS继电器可以为探测下一代3D芯片提供优势，这些芯片具有需要灵敏且非常快速的测试能力的贯穿晶片通孔。 拟议项目解决了生产的可制造性和包装挑战。 与许多RF MEMS技术使用的精品制造工艺相比，拟议项目利用了经过验证的强大硅MEMS生产工艺和基础设施。此外，使用晶片级气密封装来执行封装，这解决了RF MEMS器件的气密密封的高成本。ATE应用代表了所提出的RF MEMS继电器技术的初步应用。 随着产量的增加，无线应用以及其他应用可以通过更低的价格来实现。预期成果包括RF MEMS继电器技术，具有低成本集成封装，可随时投入生产。该项目的更广泛影响/商业潜力包括ATE，无线和科学界的RF功能。 RF MEMS可以为ATE测试下一代微芯片提供关键优势，包括与传统机械继电器相比提高的可重复性和可靠性。 RF MEMS对于测试下一代3D微芯片至关重要，这些微芯片具有贯穿晶圆通孔，需要敏感且高吞吐量的测试。 对于无线，RF MEMS解决了重新配置和调谐问题，以提高无线电的功率效率和链路鲁棒性。 例如，RF MEMS可以用于（1）将可重新配置的天线从高带宽视线配置改变为较低带宽分集配置，或者（2）补偿无线手机？的功率放大器，其不断变化的工作环境，以保持最大的效率（包括阻抗和距离基站）。 对于科学应用，RF MEMS继电器在DC至100 GHz范围内具有低插入损耗和上级线性度。 与半导体晶体管相比，RF MEMS的插入损耗大约减少了10倍。 因此，各种无线电架构以及用于监测天气和气候的辐射计可以受益。 预期的结果包括RF MEMS技术，低成本集成封装，准备和合格的生产。

This Small Business Innovation Research (SBIR) Phase I project will develop RF MEMS (Radio Frequency Microelectromechanical Systems) relays for automated test equipment (ATE), wireless frontends, and other commercial applications. As the advancement of microchip technology continues, the testing and qualification of microchips become more challenging and costly. RF MEMS may enable lower cost, higher throughput and more repeatable test and qualification in mainstream semiconductor manufacturing. In particular, RF MEMS relays may offer benefits for probing of next generation 3D chips with thru-wafer vias that require sensitive and yet very rapid test capabilities. The proposed project addresses the manufacturability and packaging challenges for production. In comparison to boutique manufacturing processes utilized by many RF MEMS technologies, the proposed project leverages the proven and robust silicon MEMS production processes and infrastructure. Furthermore, packaging is performed using wafer-level hermetic packaging that addresses the high cost of hermetic sealing for RF MEMS devices. ATE applications represent the initial application of the proposed RF MEMS relay technology. Wireless applications, as well as other applications, can be enabled by lower prices as production volumes are ramped up. Anticipated results include a RF MEMS relay technology, with low-cost integrated packaging, ready and qualified for production.The broader impact/commercial potential of this project includes ATE, wireless, and enabling RF capabilities for the scientific community. RF MEMS may offer ATE key advantages in testing next generation microchips, including improved repeatability and reliability compared to conventional mechanical relays. RF MEMS may be critical for testing next generation 3D microchips with thru-wafer-vias that require sensitive and yet high-throughput testing. For wireless, RF MEMS address reconfiguration and tuning for improved power efficiency and link robustness of radios. For example, RF MEMS may be utilized for (1) changing a reconfigurable antenna from a high bandwidth line-of-sight configuration to a lower bandwidth diversity configuration, or (2) compensating a wireless handset?s power amplifier for its changing operating environment to maintain maximum efficiency (including impedance and distance from the base station). For scientific applications, RF MEMS relays offer low insertion loss and superior linearity from DC to 100 GHz. In comparison to semiconductor transistors, RF MEMS have an approximate 10x reduction in insertion loss. Thus, a variety of radio architectures may benefit, as well as radiometers for monitoring weather and climate. Anticipated results include a RF MEMS technology, with low cost integrated packaging, ready and qualified for production.