GOALI: Experimental and Theoretical Investigation of Thermal Transport in Three-Dimensional Integrated Circuits (3D ICs)
GOALI:三维集成电路 (3D IC) 中热传输的实验和理论研究
基本信息
- 批准号:1236370
- 负责人:
- 金额:$ 20.06万
- 依托单位:
- 依托单位国家:美国
- 项目类别:Standard Grant
- 财政年份:2012
- 资助国家:美国
- 起止时间:2012-09-15 至 2016-01-31
- 项目状态:已结题
- 来源:
- 关键词:
项目摘要
CBET-1236370PI: Jain, AnkurThe vertical stacking of multiple Silicon substrates containing microelectronic circuits, often referred to as a three-dimensional integrated circuit (3D IC) promises to provide substantial performance improvement while also exacerbating the thermal management challenge. 3D IC technology introduces several new materials and interfaces whose thermal and thermomechanical performance remains poorly known. The objective of this research is to investigate and measure fundamental thermal transport and thermomechanical properties of materials and interfaces in 3D IC technology. Time-domain Joule heating methods will be used to characterize thermal transport through die-to-die interfaces in 3D ICs. Thermomechanical properties of such interfaces will be measured. This research will improve the understanding of thermal transport in 3D ICs. Experimental data obtained in this work will help validate several analytical and simulations-based models that have recently been developed. The long-term goal of this research will be to develop a complete understanding of the interaction between thermal transport and electrical design of 3D ICs and other advanced microelectronic systems. It is expected that by addressing thermal management concerns in 3D ICs, the proposed work will enable 3D ICs with improved electrical performance. This work will contribute to a More-than-Moore approach for design of next-generation microelectronics wherein cost-effective performance improvement is achieved not just by dimensional scaling, but also by vertical integration. The work will be tightly-integrated with industry partners which will facilitate technology transfer of key thermal management principles in 3D ICs to the industry. While the industry will benefit from the fundamental, enabling nature of the work, graduate students will also benefit from mentorship by leading industry technologists and internships. Undergraduate students will be included in this research through senior capstone projects and through REUs during the summer. Research findings from the project will be incorporated into graduate-level and upper-level undergraduate courses being taught at the University of Texas at Arlington.
CBET-1236370 PI:Jain,Ankur包含微电子电路的多个硅衬底的垂直堆叠,通常被称为三维集成电路(3D IC),有望提供实质性的性能改进,同时也加剧了热管理挑战。3D IC技术引入了几种新的材料和界面,其热和热机械性能仍然知之甚少。本研究的目的是研究和测量三维集成电路技术中材料和界面的基本热输运和热机械性能。时域焦耳加热方法将用于表征通过3D IC中的管芯到管芯界面的热传输。将测量这种界面的热机械性能。这项研究将提高对3D IC中热传输的理解。在这项工作中获得的实验数据将有助于验证几个分析和模拟为基础的模型,最近开发的。这项研究的长期目标是全面了解3D IC和其他先进微电子系统的热传输和电气设计之间的相互作用。预计通过解决3D IC中的热管理问题,所提出的工作将使3D IC具有更好的电气性能。这项工作将有助于更多的比摩尔的方法设计的下一代微电子产品,其中成本效益的性能改善,不仅是通过尺寸缩放,但也通过垂直集成。这项工作将与行业合作伙伴紧密结合,这将促进3D IC中关键热管理原理的技术转移到行业。虽然该行业将受益于工作的基本,使性质,研究生也将受益于领先的行业技术专家和实习指导。本科生将通过高级顶点项目和通过雷乌斯在夏季被纳入这项研究。该项目的研究成果将被纳入阿灵顿得克萨斯大学的研究生和高级本科课程。
项目成果
期刊论文数量(0)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
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Ankur Jain其他文献
Does Mesenchymal Stromal Cell Count in Pre-autologous Hematopoietic Stem Cell Transplant Peripheral Blood and Apheresis Product Predict for Infectious Complications in the Post-transplant Period?
自体造血干细胞移植前外周血和单采产品中的间充质基质细胞计数是否可以预测移植后的感染并发症?
- DOI:
- 发表时间:
2021 - 期刊:
- 影响因子:0.9
- 作者:
Ankur Jain;A. Khadwal;M. Sachdeva;P. Bose;D. Lad;S. Bhattacharya;G. Prakash;P. Malhotra;N. Varma;S. Varma - 通讯作者:
S. Varma
Heat transfer in a multi-layered semiconductor device with spatially-varying thermal contact resistance between layers
层间热接触热阻随空间变化的多层半导体器件中的传热
- DOI:
10.1016/j.icheatmasstransfer.2022.106482 - 发表时间:
2023 - 期刊:
- 影响因子:7
- 作者:
Girish Krishnan;Ankur Jain - 通讯作者:
Ankur Jain
Bloody Diarrhea in a Patient of Aggressive Lymphoma: a Diagnostic and Therapeutic Challenge
侵袭性淋巴瘤患者的血性腹泻:诊断和治疗的挑战
- DOI:
10.1007/s12288-016-0748-x - 发表时间:
2017 - 期刊:
- 影响因子:0.9
- 作者:
Ankur Jain;G. Prakash;A. Khadwal;P. Malhotra;A. Bal;J. Ahluwalia;S. Varma - 通讯作者:
S. Varma
Identifying Color in Motion in Video Sensors
识别视频传感器中的运动颜色
- DOI:
- 发表时间:
2006 - 期刊:
- 影响因子:0
- 作者:
Gang Wu;Amir M. Rahimi;E. Chang;Kingshy Goh;Tomy Tsai;Ankur Jain;Yuan - 通讯作者:
Yuan
Nonmetallic conduction property of a DNA templated gold nanowire
DNA模板金纳米线的非金属导电特性
- DOI:
- 发表时间:
- 期刊:
- 影响因子:0
- 作者:
Takashi Kodama;Ankur Jain;Kenneth E. Goodson - 通讯作者:
Kenneth E. Goodson
Ankur Jain的其他文献
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{{ truncateString('Ankur Jain', 18)}}的其他基金
I-Corps: High Performance 3D Printed Plastic Parts Through Novel Process Enhancement
I-Corps:通过创新工艺增强的高性能 3D 打印塑料零件
- 批准号:
2319061 - 财政年份:2023
- 资助金额:
$ 20.06万 - 项目类别:
Standard Grant
Travel Support for 5th Thermal and Fluids Engineering Conference (TFEC), 2020
2020 年第五届热与流体工程会议 (TFEC) 的差旅支持
- 批准号:
2002621 - 财政年份:2020
- 资助金额:
$ 20.06万 - 项目类别:
Standard Grant
CAREER: Safe, High-Performance Li-Ion Batteries Through a Fundamental Investigation of Thermal Transport in Electrochemical Materials and Interfaces
职业:通过电化学材料和界面热传输的基础研究来实现安全、高性能的锂离子电池
- 批准号:
1554183 - 财政年份:2016
- 资助金额:
$ 20.06万 - 项目类别:
Standard Grant
Indo-US Workshop on Multiscale, Multiphysics Analysis of Energy Conversion in Li-ion Batteries
印度-美国锂离子电池能量转换多尺度、多物理分析研讨会
- 批准号:
1623892 - 财政年份:2016
- 资助金额:
$ 20.06万 - 项目类别:
Standard Grant
Collaborative Research: EAGER: Enhancing Pyroelectric Effects in Nanostructured Materials for High-Efficiency Energy Conversion
合作研究:EAGER:增强纳米结构材料的热释电效应以实现高效能量转换
- 批准号:
1549967 - 财政年份:2015
- 资助金额:
$ 20.06万 - 项目类别:
Standard Grant
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