SBIR Phase I: Multistatic Spectral Interferometry for Precision Profilometry

这个小型企业创新研究计划第一阶段项目将展示高精度、非接触式3D成像和计量的创新新技术，与现有的商业光学轮廓测量方法相比，在横向分辨率、景深和测量速度方面有数量级的改进。这种技术称为多基地光谱干涉测量（MSI），结合了扫频波长干涉测量（SWI）和多基地雷达处理方面的各种尖端技术发展。与传统的光学计量方法不同，MSI不依赖于基于透镜的成像、像素化图像传感器或机械扫描。因此，MSI可以在整个扩展的测量体积中以纳米级精度在所有三个维度上执行3D表面轮廓测量，所有这些都是通过可调谐激光器的单波长扫描获得的。这种方法将使新的解决方案能够满足市场对高斜率、高纵横比部件（如模制非球面光学器件）的计量需求。该方案将通过详细的系统数值模拟和实验验证来证明MSI的可行性。预期的结果将证明MSI的能力，以满足关键的市场需求，并提供一个计算框架的设计和建模的MSI系统。 该项目更广泛的影响/商业潜力包括解决数十亿美元CMOS相机市场的关键商业需求，并加强工业界和学术界之间的研究合作和技术转让。对手机相机和其他微型成像系统的图像质量要求不断提高，这推动了对快速测试金刚石车削模具和模制非球面光学器件的新计量能力的需求。这些部件在三维上需要纳米级的形状公差，而它们的高斜率和高纵横比使得现有的表面轮廓测量解决方案不适用。该计划将展示MSI满足关键市场需求的能力，从而实现MSI技术的商业化，相关的就业增长以及新测量能力的可用性。通过工业界和学术界之间的合作，该计划将促进有意义的教育，研究和指导机会，为工程专业的学生。此外，该计划将利用和扩大学术研究基础设施，改善现有的研究工具。MSI技术的发展和成功的商业化将提供比当前最先进的仪器大大增加的测量能力。改进的测量技术推动了改进的制造和制造技术，使广泛的行业进一步实现技术进步，并为推进发现和理解提供了新的工具。

This Small Business Innovation Research Program Phase I project will demonstrate innovative new technology for high precision, non-contact 3D imaging and metrology with order of magnitude improvement in lateral resolution, depth of field, and measurement speed over existing commercial optical profiling methods. This technology, called Multistatic Spectral Interferometry (MSI), combines diverse cutting edge technological developments in swept-wavelength interferometry (SWI) and multistatic radar processing. Unlike conventional optical metrology approaches, MSI does not rely on lens based imaging, pixelated image sensors, or mechanical scanning. As a result, MSI can perform 3D surface profile measurements with nanometer level precision in all three dimensions throughout an extended measurement volume, all acquired with a single wavelength sweep of a tunable laser. This approach will enable new solutions to unmet market needs for metrology of high-slope, high-aspect ratio components such as molded aspheric optics. This program will demonstrate the feasibility of MSI though detailed numerical simulation of the system together with experimental verification. The anticipated results will demonstrate the capability of MSI to meet critical market needs and provide a computational framework for design and modeling of MSI systems. The broader impact/commercial potential of this project includes addressing a critical commercial need within the multibillion dollar CMOS camera market and strengthening research collaborations and technology transfer between industry and academia. Ever increasing image quality requirements for cell phone cameras and other miniature imaging systems have driven the need for new metrology capabilities for rapidly testing diamond turned molds and molded aspheric optics. These components require nanometer level shape tolerances in three dimensions, while their high slopes and high aspect ratios render existing surface profilometry solutions unsuitable. This program will demonstrate the ability of MSI to meet critical market requirements, leading to commercialization of MSI technology, associated job growth, and availability of new measurement capabilities. Through collaboration between industry and academia, this program will promote meaningful educational, research, and mentorship opportunities for engineering students. Additionally, this program will leverage and expand academic research infrastructure, improving available research tools. Development of MSI technology and successful commercialization will provide greatly increased metrological capabilities over current state of the art instrumentation. Improved measurement technology drives improved fabrication and manufacturing technologies, enabling further technological advancement across a wide range of industries and providing new tools for advancing discovery and understanding.