A New Robust and Energy-efficient Microactuator Device for Demanding Applications
A New Robust and Energy-efficient Microactuator Device for Demanding Applications
批准号:
1307237
负责人:
Feng Zhao
金额:
$24.01万
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2013
资助国家:
美国
项目状态:
已结题
起止时间:
2013-06-01 至 2017-05-31
中文摘要
该项目的目标是探索并为新一代微执行器设备奠定坚实的基础。该计划开发的坚固耐用的微致动器将满足在高温高压、辐射、腐蚀、化学和生物等恶劣环境下对能效和运行的迫切要求。其智力优势是开发出一种结合了光子驱动和宽带隙碳化硅材料优点的新型微致动器技术。全碳化硅平台真正发挥了碳化硅的优异材料性能,适用于要求苛刻的应用。光子驱动实现了固有的安全性、可靠性和电磁干扰抗扰性。目前限制碳化硅微电子机械系统制造的关键技术挑战将通过一种创新的表面微加工工艺来解决。高速和高能效将通过一系列独特的方法来实现。这项拟议的工作有望实现一种新的器件技术,提供恶劣的环境可操作性和长期可靠性,开辟碳化硅研究的新战略领域,并推动广泛的传感和执行系统的最新水平。更广泛的影响是使参与该项目的研究生和本科生接触到解决问题的跨学科方法,包括固态电子学、机械工程、光子和量子力学模拟,以及器件制造和表征。它将通过期刊和会议出版物、K-12外联以及产业互动和伙伴关系扩大传播,以增进对科学技术的了解。
英文摘要
The objective of this program is to explore and lay a solid foundation for a new generation of microactuator devices. The robust microactuator device developed in the program will satisfy the imperative demands of energy efficiency and operation in harsh environments, including high temperature and pressure, radiation, corrosion, chemical and biological domains, etc. The intellectual merit is to develop a novel microactuator device technology which combines the advantages of photonic actuation and wide bandgap silicon carbide material. The all silicon carbide platform truly exploits the superior material properties of silicon carbide for demanding applications. The photonic actuation enables intrinsic safety, reliability, and electromagnetic interference immunity. The key technological challenge currently limiting silicon carbide microelectromechanical systems fabrication will be solved by an innovative surface micromachining process. High speed and high energy efficiency will be accomplished by a series of unique approaches. The proposed work is expected to achieve a new device technology offering harsh environment operability and long-term reliability, open a new strategic area of research on silicon carbide, and advance the state-of-the-art of a wide range of sensing and actuating systems.The broader impacts are to expose graduate and undergraduate students involved in the project to an interdisciplinary approach for problem solving, including solid state electronics, mechanical engineering, photonic and quantum mechanical simulations, and device fabrication and characterization. It will broaden dissemination to enhance scientific and technological understanding through journal and conference publications, K-12 outreach, and industrial interaction and partnership.
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会议论文
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