AIR Option 1: Technology Translation - Buckled Stiff Thin Films on Soft Substrates for High-Resolution Strain Sensing

该PFI：空气技术翻译项目致力于将软基上弯曲的硬质薄膜作为应变传感器，以填补应变测量领域的技术空白，同时实现高空间分辨率和高灵敏度的应变映射。翻译的科学具有以下独特的特征：作为机械应变和材料特性的函数的明确的纳米级周期，易于制造，以及一维和二维图案的可调性，与该市场领域的领先竞争技术，如数字图像相关(DIC)、微云纹和扫描电子显微镜DIC技术相比，提供了改进应变传感器性能和降低制造成本的示范性科学。该项目通过进一步优化屈曲图案，实现大扫描面积和快速扫描速度，以及自动样品扫描和数据采集，从而实现了工作样机，从而实现了这一目标。该伙伴关系与英特尔公司合作，从微电子封装的角度以及通过其他形式，如部分资金支持和项目指导，为工业需求的定义提供指导，因为这些形式涉及将科学转化为可能导致竞争性商业现实的道路的潜力。预计在未来10年的商业化过程中，潜在的经济影响将达到8500万美元，这将有助于提高美国在应变测量领域的竞争力，该领域已被大量用于结构测试和电子封装应用。从长远来看，社会影响将是创新应变传感器的发展，作为应变测量家族的新成员，它经常影响许多不同的领域，从结构、电子和健康。PIS还将整合教育，特别是学生的专业发展和创业精神，以培养技术转让方面的下一代领导者。

This PFI: AIR Technology Translation project focuses on translating the science of buckled stiff thin films on soft substrates as strain sensors to fill the technology gap in the strain measurement area to simultaneously realize both high spatial resolution and high sensitivity strain mapping. The translated science has the following unique features: well-defined nanoscale periodicity as a function of mechanical strain and material properties, easiness of fabrication, and tunability of 1D and 2D patterns that provides exemplary science to improve the performance of strain sensors and reduce the cost of fabrication when compared to the leading competing technologies, such as digital image correlation (DIC), micro-Moiré, and scanning electron microscope DIC techniques in this market space. The project accomplishes this goal by further optimizing the buckling patterns, achieving large scan area with a fast scan rate, and automated sample scanning and data acquisition resulting in a working prototype. The partnership engages Intel Corporation to provide guidance in the definition of industrial needs from the perspectives of microelectronic packaging, as well as through other forms, such as partial financial support and project mentoring as they pertain to the potential to translate the science along a path that may result in a competitive commercial reality. The potential economic impact is expected to be $85M in the next 10 years of commercialization, which will contribute to the U.S. competitiveness in the strain measurement area that have been heavily used in structural testing and electronic packaging applications. The societal impact, long term, will be the development of an innovative strain sensor as a new member in the family of strain measurement, which routinely impacts many different fields, ranging from structures, electronics, and health. The PIs will also integrate education, particularly professional development and entrepreneurship for students for the next-generation leaders in technical transfer.