INSPIRE Track 1: Programming Digital Materials: Additive Assembly of Integrated Electronics

INSPIRE 轨道 1：数字材料编程：集成电子器件的增材组装

• 批准号: 1344222
• 负责人: Neil Gershenfeld
• 金额: $ 79.9万
• 依托单位: Massachusetts Institute of Technology
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 2014
• 资助国家: 美国
• 起止时间: 2014-01-01 至 2017-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1344222&HistoricalAwards=false
• 关键词: INSPIRE; Track; Programming; Digital; Materials

This INSPIRE award is partially funded by the Interdisciplinary Research Program in the Division of Civil, Mechanical and Manufacturing Innovation in the Directorate for Engineering, the Computer systems Research Program in the Division of Computer and Network Systems in the Directorate for Computer and Information Science and Engineering, and the Robust Intelligence Program in the Division of Information and Intelligent Systems in the Directorate for Computer and Information Science and Engineering.Integrated circuits are produced in billion-dollar chip fabs, which require many months of processing to go from a design to a chip. The goal of this proposal is to accomplish that in an afternoon, with a table-top process. Rather than etching or depositing electronic materials, as is done today, it is based on assembling digital materials. These use a discrete set of components, reversibly joined in a discrete set of relative positions and orientations. Those attributes allow positions to be determined by the parts, errors in their placement to be detected and corrected, dissimilar materials to be joined, and them to be disassembled rather than disposed. A conducting and insulating part type will be used to replace multilayer printed circuit boards, connectors and cabling for three-dimensional interconnect, inductors and capacitors, striplines and antennas. A resistive part type will be added for producing passive components, semiconducting part types will be added for active components, and magnetic and flexural part types for electromechanical components.This project will develop prototypes of the parts, the processes to produce them, the assemblers to place them, and the software tools to design with them. The research will progress in stages of size and complexity, reproducing the history of integrated electronics. First will be the equivalent of small-scale integration, using tens of parts with a 100 micron feature size. A test case at this level of integration will be assembling a radiofrequency matching network. Then will come medium-scale integration, using hundreds of parts with a 10 micron feature size. A goal here will be assembling a ring oscillator and binary counter. Finally, large-scale integration will use thousands of parts with a 1 micron feature size, with a goal of assembling a microprocessor. Computer-controlled manufacturing has progressed from subtractive to additive processes; this research roadmap will introduce the discrete assembly and disassembly of functional digital materials, to code the construction of complete systems in an integrated process.

该 INSPIRE 奖的部分资金来自工程局土木、机械和制造创新司的跨学科研究计划、计算机和信息科学与工程局计算机和网络系统司的计算机系统研究计划以及计算机和信息科学与工程局信息和智能系统司的鲁棒智能计划。集成电路是在价值数十亿美元的芯片工厂生产的，这需要大量资金。 从设计到芯片需要数月的处理时间。该提案的目标是通过桌面流程在一个下午内完成该任务。它不是像今天那样蚀刻或沉积电子材料，而是基于组装数字材料。它们使用一组离散的组件，以一组离散的相对位置和方向可逆地连接。这些属性允许由零件确定位置、检测和纠正零件放置中的错误、连接不同的材料以及将零件拆卸而不是丢弃。导电和绝缘部件类型将用于取代多层印刷电路板、连接器和三维互连布线、电感器和电容器、带状线和天线。将添加电阻零件类型用于生产无源元件，将添加半导体零件类型用于生产有源元件，以及磁性和弯曲零件类型用于机电元件。该项目将开发零件原型、生产过程、放置零件的装配程序以及用于设计零件的软件工具。该研究将在规模和复杂性方面取得进展，重现集成电子学的历史。首先相当于小规模集成，使用数十个具有 100 微米特征尺寸的部件。此集成级别的测试用例将组装射频匹配网络。然后是中等规模的集成，使用数百个具有 10 微米特征尺寸的部件。这里的目标是组装环形振荡器和二进制计数器。最后，大规模集成将使用数千个特征尺寸为 1 微米的零件，目标是组装微处理器。计算机控制的制造已从减材工艺发展到增材工艺；该研究路线图将介绍功能数字材料的离散组装和拆卸，以在集成过程中编码完整系统的构建。