I-Corps: DataCOOL Software Application

I-Corps:DataCOOL 软件应用程序

基本信息

  • 批准号:
    1443815
  • 负责人:
  • 金额:
    $ 5万
  • 依托单位:
  • 依托单位国家:
    美国
  • 项目类别:
    Standard Grant
  • 财政年份:
    2014
  • 资助国家:
    美国
  • 起止时间:
    2014-07-01 至 2014-12-31
  • 项目状态:
    已结题

项目摘要

Data centers (DC) are digital warehouses for information technology (IT) equipment such as computer servers, network switches, and storage devices. To maintain their computational reliability, waste heat from the DC facility is removed by dedicated cooling hardware such as computer room air conditioning units and rear door heat exchangers. Because these cooling hardware systems demand 40-50% of the data center electricity consumption (often in the order of few million kWh), their energy-efficient operation is imperative for the optimization of total cost of ownership for a DC. This team has developed a real-time software application that will recommend the optimal cooling set-points for different cooling hardware in a data center.The proposed software (DataCOOL) will deliver real-time end-to-end cooling resource optimization software for data centers. The critical value proposition of DataCOOL lies in its data center cooling cost optimization, derived from elastic resource allocation and risk mitigation from stochastic data center traffic. These values are derived from a model-order reduction algorithm. The proposed technology could potentially save 15-25% of a data center's annual operational expenditure. An extensive literature survey indicates that the proposed methodology is substantially different from the existing approaches. The primary target customers would include large IT companies with data centers such as: Cisco, Microsoft, Google, Amazon, and Facebook. On the other hand, the team also expects to work closely with mid-size data center companies like Equinix, Internap, and QTS to validate that the proposed prototype is delivering claimed cost-saving benefits.
数据中心是存储计算机服务器、网络交换机和存储设备等信息技术设备的数字仓库。为了保持计算的可靠性,直流设施的废热由专用冷却硬件(如机房空调机组和后门热交换器)除去。由于这些冷却硬件系统需要40-50%的数据中心电力消耗(通常为数百万千瓦时),因此它们的节能操作对于优化直流数据中心的总拥有成本至关重要。该团队开发了一个实时软件应用程序,可以为数据中心的不同冷却硬件推荐最佳冷却设定点。提出的软件(DataCOOL)将为数据中心提供实时端到端冷却资源优化软件。DataCOOL的关键价值主张在于其数据中心冷却成本优化,源于弹性资源分配和随机数据中心流量的风险缓解。这些值是由模型阶约简算法得到的。拟议中的技术可能会为数据中心节省15-25%的年度运营支出。广泛的文献调查表明,提出的方法与现有的方法有本质上的不同。主要目标客户将包括拥有数据中心的大型IT公司,例如:Cisco、Microsoft、b谷歌、Amazon和Facebook。另一方面,该团队还希望与中型数据中心公司(如Equinix、Internap和QTS)密切合作,以验证所提议的原型是否能够提供声称的成本节约效益。

项目成果

期刊论文数量(0)
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会议论文数量(0)
专利数量(0)

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Yogendra Joshi其他文献

Effects of power pulsations on natural convection from discrete heat sources
  • DOI:
    10.1016/0894-1777(93)90174-h
  • 发表时间:
    1993-08-01
  • 期刊:
  • 影响因子:
  • 作者:
    Yogendra Joshi;Stephen Larsen;ErhanM. Akdeniz
  • 通讯作者:
    ErhanM. Akdeniz
Comparative performance analysis of slot-embedded cooling of electric motors for various topologies
不同拓扑结构的电机槽内嵌入式冷却的性能对比分析
  • DOI:
    10.1016/j.applthermaleng.2025.125843
  • 发表时间:
    2025-06-01
  • 期刊:
  • 影响因子:
    6.900
  • 作者:
    Amitav Tikadar;Yogendra Joshi;Satish Kumar
  • 通讯作者:
    Satish Kumar
A new technique for three-dimensional transient heat transfer computations of autogenous arc welding
Errata: A new technique for three-dimensional transient heat transfer computations of autogenous arc welding
Analysis of flow boiling incipience models in computational fluid dynamics
  • DOI:
    10.1016/j.applthermaleng.2024.124530
  • 发表时间:
    2025-01-01
  • 期刊:
  • 影响因子:
  • 作者:
    Daniel Lorenzini;Yogendra Joshi
  • 通讯作者:
    Yogendra Joshi

Yogendra Joshi的其他文献

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{{ truncateString('Yogendra Joshi', 18)}}的其他基金

I-Corps: Embedded Cooling
I-Corps:嵌入式冷却
  • 批准号:
    1839072
  • 财政年份:
    2018
  • 资助金额:
    $ 5万
  • 项目类别:
    Standard Grant
Planning Grant: ERC for Control of Urban Thermal Environments (CUTE)
规划补助金:城市热环境控制 ERC (CUTE)
  • 批准号:
    1840392
  • 财政年份:
    2018
  • 资助金额:
    $ 5万
  • 项目类别:
    Standard Grant
I/UCRC Planning Grant: I/UCRC for Energy Efficient Systems
I/UCRC 规划补助金:I/UCRC 节能系统
  • 批准号:
    1034824
  • 财政年份:
    2010
  • 资助金额:
    $ 5万
  • 项目类别:
    Standard Grant
US-India Workshop: Thermal Science Group Travel to Participate in Research Workshops and the Sixth ISHMT-ASME Heat and Mass Transfer Conference, Bangalore, India, January 2004
美国-印度研讨会:热科学小组前往参加研究研讨会和第六届 ISHMT-ASME 传热与传质会议,印度班加罗尔,2004 年 1 月
  • 批准号:
    0323320
  • 财政年份:
    2003
  • 资助金额:
    $ 5万
  • 项目类别:
    Standard Grant
Research Initiation: Heat Transfer and Fluid Flow in FusionWelding
研究启动:熔焊中的传热和流体流动
  • 批准号:
    8808970
  • 财政年份:
    1988
  • 资助金额:
    $ 5万
  • 项目类别:
    Interagency Agreement
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