Workshop: Advanced Manufacturing for Smart Goods; Vancouver, Washington; May 19-20, 2015

研讨会：智能商品先进制造；

• 批准号: 1535849
• 负责人: Brian Paul
• 金额: $ 3.34万
• 依托单位: Oregon State University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2015
• 资助国家: 美国
• 起止时间: 2015-03-15 至 2016-02-29
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1535849&HistoricalAwards=false
• 关键词: Workshop; Advanced; Manufacturing; Smart; Goods

This award supports a workshop to identify advanced manufacturing research needs for the emerging Smart Goods industry to help U.S. manufacturers more quickly advance Smart Goods into the marketplace. In 2012, the U.S. information technology industry, from semiconductors to telecommunications and other information services, contributed over $1.7 trillion to U.S. gross domestic product. By 2017, about one half of spending on information technology equipment in the U.S. is projected to be in smart computing as sensors, actuators, wireless communications, and low-power computation become embedded in everyday objects called "Smart Goods", i.e., the Internet of Things. Future smart computing requirements are challenging conventional wisdom in semiconductor manufacturing making the U.S. information technology industry vulnerable to foreign investments aimed to leapfrog current advantages held by U.S. firms in silicon microelectronics. The main objectives of the workshop are to: (1) examine and review the state-of-the-art in manufacturing materials and process technologies for the emerging Smart Goods industry; (2) gather the Smart Goods industry perspective of the advanced manufacturing research needs, gaps and challenges upstream of the "big data" value stream; and (3) formulate recommendations for the next steps to advance manufacturing technologies within the Smart Goods industry. The workshop will be held in the Portland, Oregon-Vancouver, Washington metropolitan area, also known as the Silicon Forest, containing almost 900 semiconductor and electronics companies. The workshop will bring together an academic and national laboratory audience with invited industry speakers and panelists to identify advanced manufacturing research needs for the emerging Smart Goods industry. An organizing committee consisting of state, university and federal laboratory members will work with an industry advisory team to select 15-20 distinguished members from industry to deliver presentations and populate panels. Sessions will involve both presentations and panels discussing future computing requirements for many Smart Goods including the integration of low-power computation with new sensors and small power sources on complex three-dimensional surfaces. Technologies to be discussed include inkjet printing, the scaling of near monodispersed functional nanomaterials, and the photonic sintering of particle films into multifunctional films and devices. The organizing committee will compile a report after the workshop recapping the key challenges and opportunities in advanced manufacturing research for Smart Goods, and outlining the next steps for aligning universities and industry interests around a common pre-competitive research agenda. The report contents will be disseminated through the workshop website and an appropriate journal.

该奖项支持一个研讨会，以确定新兴智能产品行业的先进制造研究需求，以帮助美国制造商更快地将智能产品推向市场。 2012年，美国信息技术产业，从半导体到电信和其他信息服务，为美国国内生产总值贡献了超过1.7万亿美元。 到2017年，美国大约一半的信息技术设备支出预计将用于智能计算，因为传感器，执行器，无线通信和低功耗计算将嵌入到称为“智能商品”的日常物品中，即，物联网 未来的智能计算需求正在挑战半导体制造业的传统智慧，使美国信息技术产业容易受到旨在超越美国公司在硅微电子领域目前优势的外国投资的影响。 研讨会的主要目标是：（1）检查和审查新兴智能产品行业的制造材料和工艺技术的最新水平;（2）收集智能产品行业对先进制造研究需求的观点，“大数据”价值流上游的差距和挑战;以及（3）为智能产品行业内推进制造技术的后续步骤制定建议。 研讨会将在波特兰、俄勒冈-温哥华、华盛顿大都市区举行，该地区也被称为硅森林，包含近900家半导体和电子公司。研讨会将汇集学术和国家实验室观众与受邀的行业演讲者和小组成员，以确定新兴智能产品行业的先进制造研究需求。 一个由州、大学和联邦实验室成员组成的组委会将与一个行业咨询小组合作，从行业中挑选15-20名杰出成员进行演讲并组成小组。 会议将包括演讲和小组讨论，讨论许多智能产品的未来计算要求，包括在复杂的三维表面上将低功耗计算与新传感器和小电源集成。 将讨论的技术包括喷墨打印，近单分散功能纳米材料的缩放，以及粒子薄膜的光子烧结成多功能薄膜和器件。 组委会将在研讨会后编写一份报告，回顾智能产品先进制造研究的主要挑战和机遇，并概述围绕共同的竞争前研究议程调整大学和行业利益的下一步措施。 报告内容将通过研讨会网站和适当的期刊传播。