CM/Collaborative Research: CloudMEMS: Cybermanufacturing of Micro-Electro-Mechanical Systems

CM/合作研究：CloudMEMS：微机电系统的网络制造

• 批准号: 1643985
• 负责人: Vamsy Chodavarapu
• 金额: $ 22.5万
• 依托单位: University of Dayton
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2016
• 资助国家: 美国
• 起止时间: 2016-09-01 至 2019-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1643985&HistoricalAwards=false
• 关键词: CM; Collaborative; Research; CloudMEMS; Cybermanufacturing

The semiconductor industry is undergoing a shift towards creation of value-added products and services, rather than simply focusing on advancing the state-of-the-art in integrated circuit technology, with Micro-Electro-Mechanical Systems (MEMS) expected to play an increasingly important role in the new era. The design and development of Micro-Electro-Mechanical Systems entails sophisticated Computer-Aided-Design tools, elaborate microfabrication facilities, and extensive packaging infrastructures. Such technological barriers limit the abilities of innovators and entrepreneurs to access and use MEMS technologies. This award supports research to enable a novel, cloud-based MEMS design, development and manufacturing platform that is web-accessible, low cost, expansible and interactive. If successful, this research will foster cybermanufacturing innovation by enabling a new manufacturing service infrastructure that allows a wide range of customers and entrepreneurs to prototype their Micro-Electro-Mechanical Systems efficiently and at low cost, thereby directly benefitting the U.S. economy and society. This research also will lead to new curriculum in the rapidly emerging areas of cloud computing, electronics, microfabrication, and sensors. Educational, training, and outreach activities envisioned by this research will entail development of hands-on instructional material for minority and underrepresented high school students.The CloudMEMS platform will establish a novel "Design Anywhere, Manufacture Anywhere" approach in the design and development of Micro-Electro-Mechanical Systems via standardized processes and materials selections from leading semiconductor foundries easily made available to clients, designers, and entrepreneurs. The multi-university research team will systematically investigate process constraints in the Design-for-Manufacturing of next-generation Micro-Electro-Mechanical Systems toward enabling component design and fabrication using standard semiconductor foundry processes. The team will investigate sophisticated mathematical models and scaling laws capable of handling Micro-Electro-Mechanical Systems designs based on different structural materials and processes. Pertinent multi-pronged approaches for aiding Micro-Electro-Mechanical Systems design will be explored by (1) Fusing commercial Computer-Aided-Design packages into a cloud server and (2) Studying Micro-Electro-Mechanical Systems scaling laws for cost effective re-engineering of pre-simulated and pre-decomposed devices. The project will foster distinct design cycles for expert users and non-expert users who lack process knowledge. The CloudMEMS platform will be made accessible via Internet to bridge the cyber and manufacturing domains, thereby promoting leadership of the U.S. in cyber-driven microsystems and manufacturing.

半导体行业正在转向创造增值产品和服务，而不仅仅是专注于推进集成电路技术的最新发展，微机电系统（MEMS）预计将在新时代发挥越来越重要的作用。微机电系统的设计和开发需要复杂的计算机辅助设计工具，精细的微加工设施和广泛的封装基础设施。这种技术壁垒限制了创新者和企业家获得和使用微机电系统技术的能力。该奖项支持研究，以实现一个新颖的，基于云的MEMS设计，开发和制造平台，是网络访问，低成本，可扩展和互动。如果成功，这项研究将通过启用新的制造服务基础设施来促进网络制造创新，使广大客户和企业家能够以低成本高效地对其微机电系统进行原型设计，从而直接使美国经济和社会受益。这项研究也将导致新的课程在云计算，电子，微制造和传感器等迅速崛起的领域。这项研究所设想的教育、培训和推广活动将需要为少数民族和代表性不足的高中生开发实践教学材料。CloudMEMS平台将通过标准化的工艺和材料选择，在微机电系统的设计和开发中建立一种新颖的“随处设计，随处制造”方法，这些方法可以从领先的半导体代工厂轻松提供给客户、设计师、和企业家。多所大学的研究团队将系统地研究下一代微机电系统设计制造中的工艺约束，以实现使用标准半导体铸造工艺的组件设计和制造。该团队将研究复杂的数学模型和比例定律，能够处理基于不同结构材料和工艺的微机电系统设计。相关的多管齐下的方法来帮助微机电系统的设计将探索（1）融合商业计算机辅助设计软件包到云服务器和（2）研究微机电系统的比例法则，以成本效益的重新设计预模拟和预分解设备。该项目将为专家用户和缺乏流程知识的非专家用户提供不同的设计周期。CloudMEMS平台将通过互联网访问，以连接网络和制造领域，从而促进美国在网络驱动的微系统和制造领域的领导地位。