CM/Collaborative Research: CloudMEMS: Cybermanufacturing of Micro-Electro-Mechanical Systems

CM/合作研究：CloudMEMS：微机电系统的网络制造

• 批准号: 1912749
• 负责人: Vijaya Kumar Devabhaktuni
• 金额: $ 9.18万
• 依托单位: Purdue University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2019
• 资助国家: 美国
• 起止时间: 2019-02-15 至 2020-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1912749&HistoricalAwards=false
• 关键词: CM; Collaborative; Research; CloudMEMS; Cybermanufacturing

The semiconductor industry is undergoing a shift towards creation of value-added products and services, rather than simply focusing on advancing the state-of-the-art in integrated circuit technology, with Micro-Electro-Mechanical Systems (MEMS) expected to play an increasingly important role in the new era. The design and development of Micro-Electro-Mechanical Systems entails sophisticated Computer-Aided-Design tools, elaborate microfabrication facilities, and extensive packaging infrastructures. Such technological barriers limit the abilities of innovators and entrepreneurs to access and use MEMS technologies. This award supports research to enable a novel, cloud-based MEMS design, development and manufacturing platform that is web-accessible, low cost, expansible and interactive. If successful, this research will foster cybermanufacturing innovation by enabling a new manufacturing service infrastructure that allows a wide range of customers and entrepreneurs to prototype their Micro-Electro-Mechanical Systems efficiently and at low cost, thereby directly benefitting the U.S. economy and society. This research also will lead to new curriculum in the rapidly emerging areas of cloud computing, electronics, microfabrication, and sensors. Educational, training, and outreach activities envisioned by this research will entail development of hands-on instructional material for minority and underrepresented high school students.The CloudMEMS platform will establish a novel "Design Anywhere, Manufacture Anywhere" approach in the design and development of Micro-Electro-Mechanical Systems via standardized processes and materials selections from leading semiconductor foundries easily made available to clients, designers, and entrepreneurs. The multi-university research team will systematically investigate process constraints in the Design-for-Manufacturing of next-generation Micro-Electro-Mechanical Systems toward enabling component design and fabrication using standard semiconductor foundry processes. The team will investigate sophisticated mathematical models and scaling laws capable of handling Micro-Electro-Mechanical Systems designs based on different structural materials and processes. Pertinent multi-pronged approaches for aiding Micro-Electro-Mechanical Systems design will be explored by (1) Fusing commercial Computer-Aided-Design packages into a cloud server and (2) Studying Micro-Electro-Mechanical Systems scaling laws for cost effective re-engineering of pre-simulated and pre-decomposed devices. The project will foster distinct design cycles for expert users and non-expert users who lack process knowledge. The CloudMEMS platform will be made accessible via Internet to bridge the cyber and manufacturing domains, thereby promoting leadership of the U.S. in cyber-driven microsystems and manufacturing.

半导体行业正在转向创造增值产品和服务，而不仅仅是专注于推进最先进的集成电路技术，微机电系统（MEMS）预计将在新时代发挥越来越重要的作用。微机电系统的设计和开发需要复杂的计算机辅助设计工具、精密的微加工设施和广泛的封装基础设施。这些技术障碍限制了创新者和企业家获取和使用MEMS技术的能力。该奖项支持研究以实现新颖的、基于云的 MEMS 设计、开发和制造平台，该平台可通过网络访问、低成本、可扩展和交互式。如果成功，这项研究将通过启用新的制造服务基础设施来促进网络制造创新，使广大客户和企业家能够高效、低成本地制作微机电系统原型，从而直接使美国经济和社会受益。这项研究还将在云计算、电子、微加工和传感器等快速新兴领域催生新课程。本研究设想的教育、培训和外展活动将需要为少数族裔和代表性不足的高中生开发实践教学材料。CloudMEMS 平台将通过标准化流程和领先半导体代工厂的材料选择，在微机电系统的设计和开发中建立一种新颖的“随处设计，随处制造”方法，方便客户、设计师和企业家使用。多所大学的研究团队将系统地研究下一代微机电系统的制造设计中的工艺限制，以实现使用标准半导体铸造工艺的组件设计和制造。该团队将研究复杂的数学模型和比例定律，能够处理基于不同结构材料和工艺的微机电系统设计。将通过以下方式探索辅助微机电系统设计的相关多管齐下的方法：（1）将商业计算机辅助设计包融合到云服务器中；（2）研究微机电系统缩放法则，以对预模拟和预分解设备进行具有成本效益的重新设计。该项目将为专家用户和缺乏流程知识的非专家用户提供独特的设计周期。 CloudMEMS 平台将可通过互联网访问，以架起网络和制造领域的桥梁，从而提升美国在网络驱动的微系统和制造领域的领导地位。