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CI-New: Collaborative Research: Modeling the Next-Generation Hybrid Cooling Systems for High-Performance Processors

CI-New: Collaborative Research: Modeling the Next-Generation Hybrid Cooling Systems for High-Performance Processors
CI-New:协作研究:为高性能处理器建模下一代混合冷却系统
批准号:
1730389
负责人:
Evelyn Wang
金额:
$23.0万
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2017
资助国家:
美国
项目状态:
已结题
起止时间:
2017-07-01 至 2020-06-30

项目摘要

项目成果

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中文摘要
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英文摘要
Design of future high-performance chips is hindered by severe temperature challenges. For example, existing cooling mechanisms cannot efficiently cool the extremely high power densities that are expected in exascale systems. Emerging cooling technologies, which may address these temperature challenges, are not easily accessible for experimentation to computer engineers. In fact, there is a substantial lag before a cooling technology becomes available for system design and optimization. Such lags cause design quality to be left on the table. To this end, this project proposes a software infrastructure that enables accurate modeling of cutting-edge cooling methods and that facilitates mutually customizing the computing and cooling systems to dramatically push system energy efficiency. The proposed infrastructure is a system-level design automation tool that includes compact thermal models of emerging cooling methods (thermoelectric coolers, two-phase cooling with microchannels or nanopores, phase-change materials, and single-phase liquid cooling). The project plan includes (1) synthesizing novel device-level models into compact representations; (2) using measurements on prototypes for validation of the proposed models; and (3) developing automation tooling to co-design hybrid customized cooling subsystems together with a given computing system. The broader impact of the project will be to help advance computing beyond the limitations of Moore's Law by making efficient design of high-power-density systems possible. The proposed infrastructure will enable transformative research in design automation, computer architecture, and system design with emerging cooling technologies, particularly in the dimensions of performance, variability, energy, heterogeneity, and cross-layer design. The infrastructure will be released to the community as open source software. The interdisciplinary nature of the project creates ample opportunities for undergraduate projects and outreach programs for underrepresented groups and K-12 students.
期刊论文(4)
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科研奖励(0)
会议论文
Modeling and Optimization of Chip Cooling with Two-Phase Vapor Chambers
两相均热板切屑冷却的建模与优化
DOI: 10.1109/islped.2019.8824965
发表时间: 2019
期刊: 2019 IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED
影响因子: --
作者: [Yuan, Zihao, Vaartstra, Geoffrey, Shukla, Prachi, Reda, Sherief, Wang, Evelyn, Coskun, Ayse K.]
通讯作者: Coskun, Ayse K.
DOI: 10.1016/j.ijheatmasstransfer.2019.02.074
发表时间: 2019-06-01
期刊: INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
影响因子: 5.2
作者: [Vaartstra, Geoffrey, Lu, Zhengmao, Wang, Evelyn N.]
通讯作者: Wang, Evelyn N.
2017 Micro and Nanoscale Phase Change Heat Transfer: Fundamental Mechanisms to Applications of Phase Change Heat Transfer GRC; Galveston, Texas; January 8-13,2017
  • 批准号:
    1644770
  • 项目类别:
    Standard Grant
  • 资助金额:
    $0.96万
  • 财政年份:
    2016
  • 负责人:
    Evelyn Wang
  • 依托单位:
BRIGE: Dynamically Tunable Nanostructured Surfaces for Multiphase Microfluidics
MEMS Education Workshop. The Workshop will be held in Tucson, AR on January 13, 2008.
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