New bonding of electro-optical integrated circuits in foil substrates (D02 (A05))

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Optodic bonding of optoelectronic components yields bonds with a high mechanical strength, good electrical conductivity and suitable thermal stability, thus facilitating the coupling between optoelectronic devices and waveguides. In Subproject D02, we will address issues of heat dissipation as well as optimized coupling of light into the passive components using metal gratings. A previously-developed coating process known as Flip-and-Fuse will be employed.