New bonding of electro-optical integrated circuits in foil substrates (D02 (A05))

箔基板中电光集成电路的新型粘合（D02（A05））

• 批准号: 233025248
• 金额: --
• 依托单位: Institut für Transport- und Automatisierungstechnik (ITA)
• 依托单位国家: 德国
• 项目类别: CRC/Transregios
• 财政年份: 2013
• 资助国家: 德国
• 起止时间: 2012-12-31 至 2016-12-31
• 项目状态: 已结题
• 来源: https://gepris.dfg.de/gepris/projekt/233025248?language=en
• 关键词: New; bonding; electro; optical; integrated

Optodic bonding of optoelectronic components yields bonds with a high mechanical strength, good electrical conductivity and suitable thermal stability, thus facilitating the coupling between optoelectronic devices and waveguides. In Subproject D02, we will address issues of heat dissipation as well as optimized coupling of light into the passive components using metal gratings. A previously-developed coating process known as Flip-and-Fuse will be employed.

光电元件的光电键合产生具有高机械强度、良好导电性和适当热稳定性的键合，从而促进光电器件和波导之间的耦合。在子项目 D02 中，我们将解决散热问题以及使用金属光栅优化光耦合到无源组件中的问题。将采用先前开发的称为“Flip-and-Fuse”的涂层工艺。