New bonding of electro-optical integrated circuits in foil substrates (D02 (A05))

光电子器件的光电键合具有机械强度高、导电性好、热稳定性好等特点，有利于光电子器件与光波导的耦合。在D02子项目中，我们将解决散热问题，以及使用金属栅将光优化耦合到无源组件中。将采用以前开发的被称为Flip-and-Fuse的涂层工艺。

Optodic bonding of optoelectronic components yields bonds with a high mechanical strength, good electrical conductivity and suitable thermal stability, thus facilitating the coupling between optoelectronic devices and waveguides. In Subproject D02, we will address issues of heat dissipation as well as optimized coupling of light into the passive components using metal gratings. A previously-developed coating process known as Flip-and-Fuse will be employed.