Scalable semiconductor quantum processor with flip chip bonding technology

采用倒装芯片接合技术的可扩展半导体量子处理器

• 批准号: IM230100396
• 负责人: Dr Kok Chan
• 金额: $ 53.36万
• 依托单位: The University of New South Wales
• 依托单位国家: 澳大利亚
• 项目类别: Mid-Career Industry Fellowships
• 财政年份: 2023
• 资助国家: 澳大利亚
• 起止时间: 2023-07-21 至 2026-07-20
• 项目状态: 未结题
• 来源: https://dataportal.arc.gov.au/RGS/Web/Grants/IM230100396
• 关键词: Scalable; semiconductor; quantum; processor; flip

Australia is famous for quantum computing research based on electron spin in silicon quantum dot. This project aims to enable the manufacturing of such scalable quantum processor. Currently, superconducting quantum processor has reached >100 of qubits by the utilization of 3D integration fabrication technology such as flip chip bonding. Likewise, for semiconductor spin-qubit to grow, it is inevitable that novel 3D architecture by expanding the building block to the next dimension must be explored to pave the way to scalable semiconductor quantum processor. This project will spearhead Australia's semiconductor quantum processor to the realm of hundreds of qubits and put this technology on par with superconducting quantum processor.

澳大利亚以基于硅量子点中的电子自旋而闻名。该项目旨在使这种可扩展的量子处理器能够制造。目前，通过利用3D集成制造技术（例如翻转芯片键），超导量子处理器已达到> 100吨的Qubit。同样，要使半导体自旋量化生长，必须探索新颖的3D体系结构将构建块扩展到下一个维度，以铺平可扩展的半导体量子处理器的方式。该项目将把澳大利亚的半导体量子处理器带到数百个Qubits领域，并将这项技术与超导量子处理器相当。