Scalable semiconductor quantum processor with flip chip bonding technology

采用倒装芯片接合技术的可扩展半导体量子处理器

• 批准号: IM230100396
• 负责人: Dr Kok Chan
• 金额: $ 53.36万
• 依托单位: The University of New South Wales
• 依托单位国家: 澳大利亚
• 项目类别: Mid-Career Industry Fellowships
• 财政年份: 2023
• 资助国家: 澳大利亚
• 起止时间: 2023-07-21 至 2026-07-20
• 项目状态: 未结题
• 来源: https://dataportal.arc.gov.au/RGS/Web/Grants/IM230100396
• 关键词: Scalable; semiconductor; quantum; processor; flip

Australia is famous for quantum computing research based on electron spin in silicon quantum dot. This project aims to enable the manufacturing of such scalable quantum processor. Currently, superconducting quantum processor has reached >100 of qubits by the utilization of 3D integration fabrication technology such as flip chip bonding. Likewise, for semiconductor spin-qubit to grow, it is inevitable that novel 3D architecture by expanding the building block to the next dimension must be explored to pave the way to scalable semiconductor quantum processor. This project will spearhead Australia's semiconductor quantum processor to the realm of hundreds of qubits and put this technology on par with superconducting quantum processor.

澳大利亚以基于硅量子点中电子自旋的量子计算研究而闻名。该项目旨在使这种可扩展的量子处理器的制造成为可能。目前，超导量子处理器已经通过倒装芯片键合等三维集成制造技术达到了100个量子比特。同样，对于半导体自旋量子比特的增长，不可避免的是必须探索通过将构建块扩展到下一维来构建新的3D架构，为可扩展的半导体量子处理器铺平道路。该项目将引领澳大利亚的半导体量子处理器达到数百个量子比特的领域，并使这项技术与超导量子处理器平起平坐。