Scalable semiconductor quantum processor with flip chip bonding technology

澳大利亚以硅量子点中电子自旋为基础的量子计算研究而闻名。该项目旨在实现这种可扩展量子处理器的制造。目前，利用倒装片键合等三维集成制造技术，超导量子处理器的量子比特已达到100个。同样，为了半导体自旋量子比特的发展，必须探索将构建块扩展到下一个维度的新型3D架构，为可扩展的半导体量子处理器铺平道路。该项目将使澳大利亚的半导体量子处理器达到数百量子位，并使该技术与超导量子处理器并驾齐驱。

Australia is famous for quantum computing research based on electron spin in silicon quantum dot. This project aims to enable the manufacturing of such scalable quantum processor. Currently, superconducting quantum processor has reached >100 of qubits by the utilization of 3D integration fabrication technology such as flip chip bonding. Likewise, for semiconductor spin-qubit to grow, it is inevitable that novel 3D architecture by expanding the building block to the next dimension must be explored to pave the way to scalable semiconductor quantum processor. This project will spearhead Australia's semiconductor quantum processor to the realm of hundreds of qubits and put this technology on par with superconducting quantum processor.