课题基金 / 基金详情

GOALI: An Experimental Study of Electric Field Driven Non-Fourier Thermal Transport in High Power Electronic Devices

GOALI: An Experimental Study of Electric Field Driven Non-Fourier Thermal Transport in High Power Electronic Devices
GOALI:高功率电子器件中电场驱动非傅立叶热传输的实验研究
批准号:
1934482
负责人:
Sukwon Choi
金额:
$35.0万
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2020
资助国家:
美国
项目状态:
已结题
起止时间:
2020-03-01 至 2023-11-30

项目摘要

项目成果

Sukwon Choi的其他基金

相似基金

相关文献

中文摘要
翻译
点击翻译按钮获取中文摘要
英文摘要
Featuring broadband operation and high efficiency, gallium nitride-based radio frequency power amplifiers are key components to realize reliable, energy efficient, and ubiquitous wireless 5G networks that billions of devices use for data collection and computation. However, full implementation of gallium nitride microelectronics for 5G wireless networks requires overcoming concerns about overheating. This project will investigate and identify the thermal transport mechanisms leading to the discrepancies between theoretical predictions and experimental observations, to allow design of effective thermal management for reliable performance. Moreover, this project will encompass educational tasks designed to bridge the gap between thermal sciences and electronic device physics and to lower the entry barrier for undergraduate students to study nanoscale heat transfer principles. The educational activities will also expose underrepresented students to industry-driven academic research and inspire K-12 students to pursue STEM-related fields.The research goal of this project is to experimentally identify and probe nanoscopic, non-Fourier thermal transport mechanisms that are responsible for the amplified heating within gallium nitride transistors simultaneously subjected to extreme electric field and heat flux conditions. It is hypothesized that the observed amplified heating is a combined result of nanoscale heat source size effects, electric field induced deformation of the gallium nitride crystal, and thermal non-equilibrium among energy carriers, all of which are caused by a nanoscale electric field spike. A deep ultraviolet thermal imaging capability which offers the highest spatial resolution among commercial thermal imaging systems will be developed in order to test this hypothesis and to study the fundamental physics in gallium nitride transistors. The developed deep ultraviolet thermal imaging technique will be used together with Raman spectroscopy, photoluminescence, and a novel multi-scale electro-thermal modeling scheme to study the physical origins of the amplified heating in high voltage-biased gallium nitride transistors. Research outcomes will facilitate electro-thermal co-design and improve industry standard methods for lifetime assessment of gallium nitride power amplifiers.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.
期刊论文(19)
专著(0)
科研奖励(0)
会议论文
DOI: 10.1109/tcpmt.2021.3091555
发表时间: 2021-08-01
期刊: IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
影响因子: 2.2
作者: [Shoemaker, Daniel, Malakoutian, Mohamadali, Choi, Sukwon]
通讯作者: Choi, Sukwon
Experimental Probing of the Bias Dependent Self-Heating in AlGaN/GaN HEMTs With a Transparent Indium Tin Oxide Gate
具有透明氧化铟锡栅极的 AlGaN/GaN HEMT 中偏压相关自加热的实验探测
DOI: 10.1115/ipack2022-98800
发表时间: 2022
期刊: ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
影响因子: --
作者: [Karim, Anwarul, Kim, Tae Kyoung, Shoemaker, Daniel, Song, Yiwen, Kwak, Joon Seop, Choi, Sukwon]
通讯作者: Choi, Sukwon
Deep-Ultraviolet Thermoreflectance Thermal Imaging of GaN High Electron Mobility Transistors
GaN 高电子迁移率晶体管的深紫外热反射热成像
DOI: 10.1109/itherm54085.2022.9899680
发表时间: 2022
期刊: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm
影响因子: --
作者: [Shoemaker, Daniel C., Karim, Anwarul, Kendig, Dustin, Kim, Hyungtak, Choi, Sukwon]
通讯作者: Choi, Sukwon
DOI: 10.1115/1.4047100
发表时间: 2020-05
期刊: Journal of Electronic Packaging
影响因子: 1.6
作者: [J. S. Lundh;Yiwen Song;B. Chatterjee;A. Baca;R. Kaplar;A. Armstrong;A. Allerman;B. Klein;D. Kendig;Hyungtak Kim;Sukwon Choi]
通讯作者: J. S. Lundh;Yiwen Song;B. Chatterjee;A. Baca;R. Kaplar;A. Armstrong;A. Allerman;B. Klein;D. Kendig;Hyungtak Kim;Sukwon Choi
14
    FuSe-TG: Electro-Thermal Co-Design Center for Ultra-Wide Bandgap Semiconductor Devices
    海外基金