13th International Conference on the Technology of Plasticity (ICTP 2020); Columbus, Ohio; July 26-31, 2020

该奖项支持多达25名美国机构的学生和15名博士后研究人员参加将于2020年7月26日至31日在俄亥俄州立大学举行的第十三届国际塑性技术会议(ICTP2020)。2020年ICTP，由冶金学会(TMS)主办。将汇集来自世界各地的研究人员、专业人士和工程师，讨论金属成形技术和科学的所有主要领域的改进和创新。该奖项为年轻研究人员提供了与来自世界各地工业和政府机构的顶尖研究人员和工程师以及来自国内和国际工程学院的学生和教职员工交流思想的机会。除了培养全球制造视野外，学员还将学习金属成形方面的最新研究领域和成果。2020年ICTP2020的主题领域将包括与传统领域有关的会议，如金属成形工艺、通过变形连接、微观结构表征和通过成形进行的开发，还将包括一些关于创新和前瞻性主题的会议，例如大数据和人工智能在金属成形中的作用，以及敏捷金属成形和高速脉冲成形技术和技术的出现，以加快创新。申请的资金将用于为年轻研究人员提供参与者支持。将大力鼓励任职人数不足的团体提出申请，并将向来自任何一所大学或组织的不超过三名个人提供支助，以鼓励与会机构之间的多样性。此外，还将向一些受邀的主旨演讲者提供援助奖，以采购海报会议所需的用品，预计将吸引50多名职业生涯早期演讲者参加，并部分支付会议记录的制作和印刷费用。与会者将完成一项调查，以确定该计划中最受欢迎的会议和方面，从而使未来的会议能够扩大主题焦点或涵盖尚未探索的新领域。该奖项反映了NSF的法定使命，并通过使用基金会的智力优势和更广泛的影响审查标准进行评估，被认为值得支持。

This award supports up to 25 students and 15 postdoctoral researchers at US institutions to participate in the Thirteenth International Conference on the Technology of Plasticity (ICTP2020), to be held at The Ohio State University on July 26-31, 2020. The ICTP 2020, sponsored by the Metallurgical Society (TMS). will bring together researchers, professionals, and engineers from around the world to discuss improvements and innovations in all major areas of the technology and science of metal forming. The award provides young researchers with opportunities to exchange ideas with leading researchers and engineers from worldwide industrial and governmental facilities, as well as with students and faculty from both domestic and international engineering schools. In addition to nurturing a global manufacturing vision, participants will learn the latest research areas and results in metal forming. Topical areas at the ICTP2020 will include sessions concerned with traditional fields, such metal forming processes, joining by deformation, and microstructure characterization and development by forming, and will also include a number of sessions on innovative, forward-looking topics, such as the role of Big Data and Artificial Intelligence in metal forming, and the emergence of agile metal forming and high-speed impulse forming techniques and technologies to speed innovations. Requested funds will be used to provide participant support for young researchers. Underrepresented groups will be strongly encouraged to apply and support will be provided to no more than three individuals from any one university or organization to encourage diversity among the institutions represented. In addition, assistance awards will be provided to some invited keynote speakers, to procure supplies needed for the poster session, which is anticipated to draw over 50 early career presenters, and to partially defray the cost of producing and printing the conference proceedings. Attendees will complete a survey to determine the most popular sessions and aspects of the program that will allow future conferences to expand the topic focus or cover new areas that were not explored.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.