IUCRC Phase I: University of Arkansas: Center for High-Frequency Electronics and Circuits for Communication Systems (CHECCS)

阿肯色大学、田纳西大学和佛罗里达国际大学建立了高频电子和通信系统电路中心（CHECCS），这是一个产学研合作研究中心（IUCRC）。这三所大学的努力将为开发新的研究知识提供合作机会，以支持美国在5G/6G及以后的无线通信技术方面的竞争力。CHECCS解决了增加高频电路和通信系统服务的可及性的潜力。该中心的研究将与教育活动无缝结合，研究成果将纳入培养本科生和研究生的课程。该中心还致力于扩大代表性不足群体的参与。未被充分代表的教师、研究生和本科生将被每个站点积极招募，从事和参与中心的研究和教育活动，包括外展活动。高频设备、电路和通信系统的技术领域对美国工业、经济和国家安全至关重要。CHECCS的任务是在单个芯片上为未来的多尺度系统开发不同级别的集成组件。CHECCS汇集了广泛学科的实力和专业知识，大大提高了知识水平，弥合了大学与行业之间的差距。研究领域涵盖电气工程、计算机工程、材料科学、交通运输和物理等广泛学科。该中心将与工业界和政府机构密切合作，通过结合参与研究小组的知识，创造一种将工程研究与技术创新联系起来的文化，解决多学科研究挑战。这种联系将通过与工业/从业者组织和技术转让办事处的持续伙伴关系来实现。CHECCS的核心优势是拥有一支具有学术和行业研究经验的充满活力的团队，重点是综合电磁建模，单片微波和毫米波集成电路，射频大功率元件和系统，天线设计以及高达太赫兹频率的数字和模拟电路设计。该团队拥有先进的制造，测试和高性能计算资源，以及与行业的紧密联系，这将使研究领域得到改进。该奖项反映了美国国家科学基金会的法定使命，并通过使用基金会的知识价值和更广泛的影响审查标准进行评估，被认为值得支持。

The University of Arkansas, University of Tennessee, and Florida International University have established the Center for High-Frequency Electronics and Circuits for Communication Systems (CHECCS), an Industry-University Cooperative Research Center (IUCRC). The efforts at the three universities will provide cooperative opportunities to develop new research knowledge to support U.S. competitiveness in wireless communications technologies, including 5G/6G and beyond. CHECCS addresses the potential to increase accessibility to high-frequency circuits and communication-system services. The center’s research will be seamlessly integrated with educational activities, and findings will be incorporated into courses for training undergraduate and graduate students. The center is also committed to broadening participation of underrepresented groups. Underrepresented faculty, graduate and undergraduate students will be actively recruited by each site to work on and participate in the center’s research and educational activities including outreach events. The technical area of high-frequency devices, circuits and communication systems is critically important to U.S. industry, its economy, and national security. CHECCS’ mission is in developing different levels of integrated components for future multi-scale systems on a single chip. CHECCS brings strength and expertise from a wide range of disciplines to significantly advance knowledge and bridge the gap between universities and industry. The research areas cover a broad range of disciplines from electrical engineering, to computer engineering, materials science, transportation, and physics. The center will work closely with industry and government agencies in addressing multidisciplinary research challenges by combining knowledge from participating research groups and creating a culture that links engineering research to technological innovation. This linkage will be achieved through sustained partnerships with industry/practitioner organizations and technology transfer offices. Core strengths of CHECCS include a dynamic team that has both academic and industry research experience, with emphasis on comprehensive electromagnetic modeling, monolithic microwave and millimeter-wave integrated circuits, radiofrequency high-power components and systems, antenna design, and digital and analog circuit design up to terahertz frequency. The team has access to advanced fabrication, testing, and high-performance computational resources, as well as strong ties to industry that will enable refinement of the research areas.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.